Inventor · disambiguated record
Sun-Won Kang
Also filed as: KANG SUN-WON
42 granted patents·14 pending applications·489 citations·filing 1996–2024
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD39KANG SUN-WON6BAEK SEUNG-DUK3HYUNDAI MOTOR CO LTD2CHA SEUNG-YONG1
Top patents by PatentIndex Score
56 records- 0198US7598607B2Semiconductor packages with enhanced joint reliability and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 6, 2009·101 cites·14 claims
- 0296US8791580B2Integrated circuit packages having redistribution structuresPARK CHUL·Filed 2012·Granted Jul 29, 2014·40 cites·18 claims
- 0395US8153521B2Wafer-level stack packageKANG SUN-WON·Filed 2010·Granted Apr 10, 2012·23 cites·10 claims
- 0490US10756062B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·6 cites·20 claims
- 0590US7508061B2Three-dimensional semiconductor module having multi-sided ground blockSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 24, 2009·20 cites·33 claims
- 0690US5669642AOutside door handle automatic locking device for automobilesHYUNDAI MOTOR CO LTD·Filed 1996·Granted Sep 23, 1997·122 cites·6 claims
- 0789US7588964B2Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 15, 2009·18 cites·13 claims
- 0886US7129571B2Semiconductor chip package having decoupling capacitor and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 31, 2006·42 cites·20 claims
- 0984US9859263B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·5 cites·14 claims
- 1082US7964948B2Chip stack, chip stack package, and method of forming chip stack and chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 21, 2011·10 cites·66 claims
- 1181US10679956B2Semiconductor memory chip, semiconductor memory package, and electronic system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·4 cites·20 claims
- 1281US7893526B2Semiconductor package apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 22, 2011·11 cites·15 claims
- 1379US8519470B2Semiconductor chip, and semiconductor package and system each including the semiconductor chipKANG SUN-WON·Filed 2011·Granted Aug 27, 2013·6 cites·15 claims
- 1479US8254140B2Mounting substrateLEE KWANG-YONG·Filed 2009·Granted Aug 28, 2012·8 cites·17 claims
- 1579US7884458B2Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 8, 2011·8 cites·20 claims
- 1679US7663903B2Semiconductor memory device having improved voltage transmission path and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·6 cites·18 claims
- 1777US7586182B2Packaged semiconductor die and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 8, 2009·7 cites·20 claims
- 1876US9780049B2Semiconductor packageSAMSUNG ELECTRONICS LTD·Filed 2014·Granted Oct 3, 2017·5 cites·22 claims
- 1975US7924592B2Semiconductor memory device having improved voltage transmission path and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Apr 12, 2011·3 cites·25 claims
- 2074US10141293B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·2 cites·20 claims
- 2174US7777308B2Integrated circuit packages including sinuous lead framesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·6 cites·20 claims
- 2272US8039928B2Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 18, 2011·4 cites·37 claims
- 2371US8097940B2Stack packageBAEK SEUNG-DUK·Filed 2009·Granted Jan 17, 2012·5 cites·15 claims
- 2470US7759716B2Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jul 20, 2010·4 cites·20 claims
- 2568US8115324B2Semiconductor moduleKANG SUN-WON·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 2668US7196532B2Test probe for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 27, 2007·4 cites·11 claims
- 2767US8143693B2Semiconductor device including redistribution line structure and method of fabricating the sameBAEK SEUNG-DUK·Filed 2008·Granted Mar 27, 2012·4 cites·22 claims
- 2866US10134713B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 2965US8922012B2Integrated circuit chip and flip chip package having the integrated circuit chipPARK JIN-WOO·Filed 2010·Granted Dec 30, 2014·2 cites·11 claims
- 3063US8446016B2Chip stack packageKANG SUN-WON·Filed 2011·Granted May 21, 2013·1 cites·39 claims
- 3162US7812445B2Semiconductor memory module having an oblique memory chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 12, 2010·2 cites·23 claims
- 3261US2025149456A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3358US7652383B2Semiconductor package module without a solder ball and method of manufacturing the semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·1 cites·8 claims
- 3453US10784216B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 3553US7471097B2Test probe with planar ground tip extending transversely from the ground barrel for a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 30, 2008·1 cites·10 claims
- 3652US2009166840A1Wafer-level stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3751US2009109642A1Semiconductor modules and electronic devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3850US8174860B2Semiconductor memory device having improved voltage transmission path and driving method thereofKANG SUN-WON·Filed 2011·Granted May 8, 2012·0 cites·31 claims
- 3949US8928154B2Semiconductor moduleKANG SUN-WON·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 4048US10297559B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 21, 2019·0 cites·20 claims
- 4148US7851256B2Method of manufacturing chip-on-chip semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 14, 2010·0 cites·21 claims
- 4248US6779303B2Vehicular power window safety deviceHYUNDAI MOTOR CO LTD·Filed 2002·Granted Aug 24, 2004·4 cites·16 claims
- 4347US2010038778A1Integrated circuit structures and fabricating methods that use voids in through holes as joining interfacesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 4447US2009129026A1Heat sink for semiconductor device and semiconductor module assembly including the heat sinkSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4545US10269740B2Semiconductor memory chip, semiconductor memory package, and electronic system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·30 claims
- 4645US2008179734A1Stacked package, method of manufacturing the same, and memory card having the stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4745US2008128882A1Chip stack package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4845US2008116572A1Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4943US2007252257A1Semiconductor package structures having heat dissipative element directly connected to internal circuit and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 5042US2007126114A1Heat-dissipating member, method of manufacturing the same, semiconductor module having the heat-dissipating member, and method of manufacturing the semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →