Inventor · disambiguated record
Aleksandar Aleksov
Also filed as: ALEKSOV ALEKSANDAR · ALEKSOV ALEKSANDAR ALEKS
224 granted patents·102 pending applications·611 citations·filing 2007–2025
99Inventor score
Top patents by PatentIndex Score
326 records- 0198US11990448B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted May 21, 2024·5 cites·18 claims
- 0298US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0397US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0497US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0597US9915978B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Mar 13, 2018·35 cites·5 claims
- 0696US12057402B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Aug 6, 2024·3 cites·20 claims
- 0796US11393766B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2020·Granted Jul 19, 2022·3 cites·18 claims
- 0896US10727185B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2016·Granted Jul 28, 2020·11 cites·20 claims
- 0996US9735893B1Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2016·Granted Aug 15, 2017·53 cites·20 claims
- 1095US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 1195US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 1295US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 1394US11728258B2Electroless metal-defined thin pad first level interconnects for lithographically defined viasINTEL CORP·Filed 2021·Granted Aug 15, 2023·2 cites·6 claims
- 1494US11050155B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jun 29, 2021·7 cites·20 claims
- 1594US10976822B2Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Apr 13, 2021·12 cites·25 claims
- 1694US10314171B1Package assembly with hermetic cavityINTEL CORP·Filed 2017·Granted Jun 4, 2019·10 cites·20 claims
- 1794US9832863B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Nov 28, 2017·10 cites·6 claims
- 1893US10964178B2Systems, methods and apparatuses for implementing increased human perception of haptic feedback systemsINTEL CORP·Filed 2016·Granted Mar 30, 2021·10 cites·26 claims
- 1993US10951248B1Radio frequency (RF) module with shared inductorINTEL CORP·Filed 2019·Granted Mar 16, 2021·9 cites·10 claims
- 2093US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 2193US9233835B2Shaped and oriented solder jointsALEKSOV ALEKSANDAR·Filed 2011·Granted Jan 12, 2016·18 cites·13 claims
- 2292US9967040B2Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2017·Granted May 8, 2018·14 cites·20 claims
- 2391US11147197B2Microelectronic package electrostatic discharge (ESD) protectionINTEL CORP·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 2491US11133263B2High-density interconnects for integrated circuit packagesINTEL CORP·Filed 2019·Granted Sep 28, 2021·6 cites·22 claims
- 2591US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 2691US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 2791US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 2890US9893438B1Electrical connectors for high density attach to stretchable boardsINTEL CORP·Filed 2016·Granted Feb 13, 2018·7 cites·6 claims
- 2989US12199018B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Jan 14, 2025·2 cites·20 claims
- 3089US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 3189US11316497B2Multi-filter dieINTEL CORP·Filed 2019·Granted Apr 26, 2022·4 cites·20 claims
- 3289US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 3389US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 3488US10039186B2Stretchable and flexible electrical substrate interconnectionsINTEL CORP·Filed 2016·Granted Jul 31, 2018·5 cites·19 claims
- 3588US2025125275A1Multi-chip package with high density interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 3686US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 3786US10714434B1Integrated magnetic inductors for embedded-multi-die interconnect bridge substratesINTEL CORP·Filed 2018·Granted Jul 14, 2020·4 cites·20 claims
- 3886US9786769B2Complementary tunneling FET devices and method for forming the sameINTEL CORP·Filed 2013·Granted Oct 10, 2017·4 cites·6 claims
- 3985US11310907B2Microelectronic package with substrate-integrated componentsINTEL CORP·Filed 2019·Granted Apr 19, 2022·3 cites·13 claims
- 4085US10872872B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2016·Granted Dec 22, 2020·4 cites·17 claims
- 4185US10685949B2Flexible electronic system with wire bondsINTEL CORP·Filed 2017·Granted Jun 16, 2020·4 cites·18 claims
- 4285US10215164B2Fabric-based piezoelectric energy harvestingINTEL CORP·Filed 2015·Granted Feb 26, 2019·3 cites·19 claims
- 4385US2024266745A1Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 4484US12288751B2Microelectronic assembliesINTEL CORP·Filed 2023·Granted Apr 29, 2025·0 cites·4 claims
- 4584US12136596B2Microelectronic assembliesINTEL CORP·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 4684US11348897B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 31, 2022·3 cites·7 claims
- 4784US11088103B2First layer interconnect first on carrier approach for EMIB patchINTEL CORP·Filed 2018·Granted Aug 10, 2021·3 cites·20 claims
- 4884US2025069902A1Integrated circuit package supportsINTEL CORP·Filed 2024·Application pending·0 cites
- 4983US12176223B2Integrated circuit package supportsINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 5083US12155133B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
Showing the top 50 of 326 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →