Inventor · disambiguated record
Tsuyoshi Yoda
Also filed as: YODA TSUYOSHI
22 granted patents·2 pending applications·77 citations·filing 2001–2017
93Inventor score
Top patents by PatentIndex Score
24 records- 0196US9070637B2Device-mounted substrate, infrared light sensor and through electrode forming methodYODA TSUYOSHI·Filed 2012·Granted Jun 30, 2015·38 cites·20 claims
- 0285US7784913B2Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing methodSEIKO EPSON CORP·Filed 2006·Granted Aug 31, 2010·7 cites·29 claims
- 0382US9349673B2Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted May 24, 2016·6 cites·2 claims
- 0478US8796823B2Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatusSEIKO EPSON CORP·Filed 2012·Granted Aug 5, 2014·3 cites·14 claims
- 0575US8839520B2Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing methodYODA TSUYOSHI·Filed 2010·Granted Sep 23, 2014·2 cites·6 claims
- 0674US8330256B2Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatusYODA TSUYOSHI·Filed 2009·Granted Dec 11, 2012·5 cites·14 claims
- 0772US9254653B2Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Feb 9, 2016·3 cites·8 claims
- 0869US9437489B2Method of manufacturing a wiring substrateSEIKO EPSON CORP·Filed 2013·Granted Sep 6, 2016·2 cites·3 claims
- 0967US8621926B2Wiring substrate, piezoelectric oscillator and gyrosensorYODA TSUYOSHI·Filed 2011·Granted Jan 7, 2014·2 cites·4 claims
- 1066US9579892B2Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatusSEIKO EPSON CORP·Filed 2014·Granted Feb 28, 2017·2 cites·10 claims
- 1158US9257404B2Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Feb 9, 2016·0 cites·7 claims
- 1257US7326639B2Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless platingSEIKO EPSON CORP·Filed 2005·Granted Feb 5, 2008·2 cites·9 claims
- 1356US10377134B2MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing methodSEIKO EPSON CORP·Filed 2017·Granted Aug 13, 2019·0 cites·18 claims
- 1452US6900117B2Method of fabricating bumps utilizing a resist layer having photosensitive agent and resinSEIKO EPSON CORP·Filed 2001·Granted May 31, 2005·5 cites·21 claims
- 1550US7521797B2Method of manufacturing substrate joint body, substrate joint body and electrooptical deviceSEIKO EPSON CORP·Filed 2005·Granted Apr 21, 2009·0 cites·10 claims
- 1649US8960861B2Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting headSEIKO EPSON CORP·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 1748US7390079B2Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatusSEIKO EPSON CORP·Filed 2006·Granted Jun 24, 2008·0 cites·11 claims
- 1847US9902150B2Liquid ejecting head, and manufacturing method of liquid ejecting headSEIKO EPSON CORP·Filed 2016·Granted Feb 27, 2018·0 cites·8 claims
- 1941US10121957B2Method for manufacturing a liquid discharging head or portion thereofSEIKO EPSON CORP·Filed 2015·Granted Nov 6, 2018·0 cites·1 claims
- 2040US9822452B2Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatusSEIKO EPSON CORP·Filed 2015·Granted Nov 21, 2017·0 cites·20 claims
- 2137US9517624B2Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2015·Granted Dec 13, 2016·0 cites·2 claims
- 2236US2006062978A1Film forming method, electronic device and electronic apparatusYOTSUYA SHINICHI·Filed 2005·Application pending·0 cites
- 2333US9708715B2Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatusSEIKO EPSON CORP·Filed 2015·Granted Jul 18, 2017·0 cites·7 claims
- 2430US2018250935A1Electronic deviceSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →