Inventor · disambiguated record
Jun Wan Kim
Also filed as: KIM JUN WAN
5 granted patents·8 pending applications·11 citations·filing 2013–2023
70Inventor score
Top patents by PatentIndex Score
13 records- 0182US9287124B2Method of etching a boron doped carbon hardmaskAPPLIED MATERIALS INC·Filed 2014·Granted Mar 15, 2016·8 cites·17 claims
- 0277US11154580B1Composition for preventing, ameliorating or treating acne symptoms using natural extracts as active ingredientsCELIM BIOTECH CO LTD·Filed 2021·Granted Oct 26, 2021·1 cites·6 claims
- 0368US2024421418A1Secondary BatteryLG ENERGY SOLUTION LTD·Filed 2023·Application pending·0 cites
- 0466US2024170708A1Electrode Assembly Laminating RollerLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 0565US9418867B2Mask passivation using plasmaAPPLIED MATERIALS INC·Filed 2014·Granted Aug 16, 2016·2 cites·12 claims
- 0664US2024383063A1Welding rod fastening method and welding device having welding rod vertically fastened thereto by sameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 0759US2024228214A1Electrode Running Roller and Notching Device Comprising the SameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 0846US11114652B2Method for manufacturing secondary battery electrode, and secondary battery electrode manufactured therebyLG CHEMICAL LTD·Filed 2018·Granted Sep 7, 2021·0 cites·4 claims
- 0945US2023072029A1Winding deviceLG ENERGY SOLUTION LTD·Filed 2021·Application pending·0 cites
- 1044US11283101B2Method of preparing electrodes having uniform quality and electrode assembly preparation method including the sameLG CHEMICAL LTD·Filed 2017·Granted Mar 22, 2022·0 cites·7 claims
- 1144US2024079894A1Pressure channel and secondary battery charging/discharging device comprising sameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 1244US2024055877A1Pressurizing channel and secondary battery charging/discharging device comprising sameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 1340US2015064880A1Post etch treatment technology for enhancing plasma-etched silicon surface stability in ambientAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
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