Inventor · disambiguated record
Girish Dixit
Also filed as: DIXIT GIRISH · DIXIT GIRISH A · DIXIT GIRISH ANANT
92 granted patents·38 pending applications·4,343 citations·filing 1990–2025
99Inventor score
Files withAPPLIED MATERIALS INC47SGS THOMSON MICROELECTRONICS24TEXAS INSTRUMENTS INC14ACTAVIS GROUP PTC EHF9DIXIT GIRISH7
Top patents by PatentIndex Score
130 records- 0199US9390909B2Soft landing nanolaminates for advanced patterningNOVELLUS SYSTEMS INC·Filed 2014·Granted Jul 12, 2016·500 cites·18 claims
- 0298US7018941B2Post treatment of low k dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·674 cites·20 claims
- 0398US6589352B1Self aligning non contact shadow ring process kitAPPLIED MATERIALS INC·Filed 1999·Granted Jul 8, 2003·566 cites·26 claims
- 0498US6277249B1Integrated process for copper via filling using a magnetron and target producing highly energetic ionsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 21, 2001·273 cites·27 claims
- 0598US6274008B1Integrated process for copper via fillingAPPLIED MATERIALS INC·Filed 2000·Granted Aug 14, 2001·231 cites·19 claims
- 0697US6451177B1Vault shaped target and magnetron operable in two sputtering modesAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·103 cites·26 claims
- 0796US7510634B1Apparatus and methods for deposition and/or etch selectivityNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 31, 2009·33 cites·25 claims
- 0894US6991709B2Multi-step magnetron sputtering processAPPLIED MATERIALS INC·Filed 2004·Granted Jan 31, 2006·46 cites·24 claims
- 0994US6787006B2Operating a magnetron sputter reactor in two modesAPPLIED MATERIALS INC·Filed 2002·Granted Sep 7, 2004·53 cites·31 claims
- 1093US8314235B2Process for preparing varenicline, varenicline intermediates, pharmaceutically acceptable salts thereofDIXIT GIRISH·Filed 2009·Granted Nov 20, 2012·45 cites·8 claims
- 1193US8017523B1Deposition of doped copper seed layers having improved reliabilityNOVELLUS SYSTEMS INC·Filed 2008·Granted Sep 13, 2011·27 cites·16 claims
- 1293US7727882B1Compositionally graded titanium nitride film for diffusion barrier applicationsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 1, 2010·60 cites·40 claims
- 1393US6824612B2Electroless plating systemAPPLIED MATERIALS INC·Filed 2001·Granted Nov 30, 2004·67 cites·24 claims
- 1493US6821909B2Post rinse to improve selective deposition of electroless cobalt on copper for ULSI applicationAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·62 cites·22 claims
- 1593US6610189B2Method and associated apparatus to mechanically enhance the deposition of a metal film within a featureAPPLIED MATERIALS INC·Filed 2001·Granted Aug 26, 2003·35 cites·22 claims
- 1692US8342119B2Self aligning non contact shadow ring process kitAPPLIED MATERIALS INC·Filed 2007·Granted Jan 1, 2013·11 cites·2 claims
- 1792US7425716B2Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beamAPPLIED MATERIALS INC·Filed 2006·Granted Sep 16, 2008·14 cites·27 claims
- 1892US6485618B2Integrated copper fill processAPPLIED MATERIALS INC·Filed 2001·Granted Nov 26, 2002·47 cites·26 claims
- 1992US6355559B1Passivation of inlaid metallizationTEXAS INSTRUMENTS INC·Filed 2000·Granted Mar 12, 2002·73 cites·9 claims
- 2091US9905423B2Soft landing nanolaminates for advanced patterningNOVELLUS SYSTEMS INC·Filed 2016·Granted Feb 27, 2018·5 cites·14 claims
- 2191US8062977B1Ternary tungsten-containing resistive thin filmsASHTIANI KAIHAN·Filed 2009·Granted Nov 22, 2011·38 cites·12 claims
- 2291US6808611B2Methods in electroanalytical techniques to analyze organic components in plating bathsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 26, 2004·42 cites·35 claims
- 2391US6355558B1Metallization structure, and associated method, to improve crystallographic texture and cavity fill for CVD aluminum/PVD aluminum alloy filmsTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 12, 2002·124 cites·7 claims
- 2489US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 2589US8124522B1Reducing UV and dielectric diffusion barrier interaction through the modulation of optical propertiesWU HUI-JUNG·Filed 2008·Granted Feb 28, 2012·31 cites·10 claims
- 2688US7205228B2Selective metal encapsulation schemesAPPLIED MATERIALS INC·Filed 2004·Granted Apr 17, 2007·40 cites·33 claims
- 2787US6824666B2Electroless deposition method over sub-micron aperturesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 30, 2004·42 cites·102 claims
- 2886US7115534B2Dielectric materials to prevent photoresist poisoningAPPLIED MATERIALS INC·Filed 2004·Granted Oct 3, 2006·39 cites·21 claims
- 2986US6951599B2Electropolishing of metallic interconnectsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 4, 2005·21 cites·19 claims
- 3086US6566258B1Bi-layer etch stop for inter-level viaAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·42 cites·14 claims
- 3186US6130156AVariable doping of metal plugs for enhanced reliabilityTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 10, 2000·87 cites·38 claims
- 3286US5108951AMethod for forming a metal contactSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Apr 28, 1992·80 cites·19 claims
- 3384US6913680B1Method of application of electrical biasing to enhance metal depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jul 5, 2005·30 cites·17 claims
- 3484US6905622B2Electroless deposition methodAPPLIED MATERIALS INC·Filed 2002·Granted Jun 14, 2005·32 cites·45 claims
- 3583US12080562B2Atomic layer etch and ion beam etch patterningLAM RES CORP·Filed 2020·Granted Sep 3, 2024·1 cites·16 claims
- 3682US6358849B1Integrated circuit interconnect and methodTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 19, 2002·66 cites·5 claims
- 3780US8552194B2Process for preparing quinoline-3-carboxamide derivativesDIXIT GIRISH·Filed 2009·Granted Oct 8, 2013·2 cites·15 claims
- 3880US6899816B2Electroless deposition methodAPPLIED MATERIALS INC·Filed 2002·Granted May 31, 2005·24 cites·35 claims
- 3979US6878245B2Method and apparatus for reducing organic depletion during non-processing time periodsAPPLIED MATERIALS INC·Filed 2002·Granted Apr 12, 2005·12 cites·17 claims
- 4079US6589865B2Low pressure, low temperature, semiconductor gap filling processTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 8, 2003·23 cites·12 claims
- 4177US10192742B2Soft landing nanolaminates for advanced patterningNOVELLUS SYSTEMS INC·Filed 2018·Granted Jan 29, 2019·1 cites·20 claims
- 4277US6297125B1Air-bridge integration scheme for reducing interconnect delayTEXAS INSTRUMENTS INC·Filed 1999·Granted Oct 2, 2001·52 cites·9 claims
- 4376US8101597B2Quetiapine salts and their polymorphsDIXIT GIRISH·Filed 2008·Granted Jan 24, 2012·5 cites·8 claims
- 4472US6194313B1Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback processTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 27, 2001·41 cites·14 claims
- 4572US5523624AIntegrated circuit device structure with dielectric and metal stacked plug in contact holeSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Jun 4, 1996·28 cites·32 claims
- 4672US5278098AMethod for self-aligned polysilicon contact formationSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Jan 11, 1994·36 cites·7 claims
- 4769US11048174B2Method of controlling a patterning process, lithographic apparatus, metrology apparatus lithographic cell and associated computer programASML NETHERLANDS BV·Filed 2017·Granted Jun 29, 2021·1 cites·21 claims
- 4869US5593921AMethod of forming viasSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Jan 14, 1997·37 cites·12 claims
- 4968US8858763B1Apparatus and methods for deposition and/or etch selectivityKLAWUHN ERICH R·Filed 2009·Granted Oct 14, 2014·3 cites·20 claims
- 5068US2025216788A1Bubble defect reductionLAM RES CORP·Filed 2025·Application pending·0 cites
Showing the top 50 of 130 patent records by PatentIndex Score.
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