Inventor · disambiguated record
Christof Landesberger
Also filed as: LANDESBERGER CHRISTOF
13 granted patents·6 pending applications·209 citations·filing 1997–2024
90Inventor score
Files withFRAUNHOFER GES FORSCHUNG13FRAUNHOFER GES ZUR FOERDERUNGD1FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E V1Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung Ev1KLINK GERHARD1
Top patents by PatentIndex Score
19 records- 0189US6514790B1Method for handling a plurality of circuit chipsFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Feb 4, 2003·111 cites·5 claims
- 0285US8563358B2Method of producing a chip package, and chip packageLANDESBERGER CHRISTOF·Filed 2011·Granted Oct 22, 2013·19 cites·30 claims
- 0383US6756288B1Method of subdividing a waferFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Jun 29, 2004·33 cites·8 claims
- 0471US10752499B2Method for manufacturing planar thin packagesFraunhofer-Gesellschaft zur Förderung der Angewandten Forschung Ev·Filed 2018·Granted Aug 25, 2020·2 cites·14 claims
- 0565US7733624B2Method and device for electrostatic fixing of substrates with polarized moleculesFRAUNHOFER GES FORSCHUNG·Filed 2007·Granted Jun 8, 2010·2 cites·11 claims
- 0665US7027283B2Mobile holder for a waferFRAUNHOFER GES FORSCHUNG·Filed 2001·Granted Apr 11, 2006·14 cites·14 claims
- 0760US2024290724A1Three-dimensionally integrated multi-ic system with interconnect componentsFRAUNHOFER GES FORSCHUNG·Filed 2024·Application pending·0 cites
- 0859US8198135B2Method for producing flexible integrated circuits which may be provided contiguouslyKLINK GERHARD·Filed 2010·Granted Jun 12, 2012·2 cites·7 claims
- 0951US11901285B2Microelectronic arrangement and method for manufacturing the sameFRAUNHOFER GES FORSCHUNG·Filed 2021·Granted Feb 13, 2024·0 cites·23 claims
- 1048US2009162566A1Method for the selective coating of a surface with liquidYACOUB-GEORGE ERWIN·Filed 2008·Application pending·0 cites
- 1148US2021234256A1Antenna ModuleFRAUNHOFER GES FORSCHUNG·Filed 2021·Application pending·0 cites
- 1246US11570898B2Multi-layer 3D foil packageFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Jan 31, 2023·0 cites·19 claims
- 1346US10304714B2Device comprising film for electrostatic coupling of a substrate to a substrate carrierFRAUNHOFER GES FORSCHUNG·Filed 2017·Granted May 28, 2019·0 cites·23 claims
- 1446US2008076209A1Method for producing flexible integrated circuits which may be provided contiguouslyFRAUNHOFER GES FORSCHUNG·Filed 2007·Application pending·0 cites
- 1545US6444493B1Method for vertically integrating active circuit planes and vertically integrated circuit produced using said methodFRAUNHOFER GES FORSCHUNG·Filed 1999·Granted Sep 3, 2002·13 cites·10 claims
- 1644US6328841B1Process for joining inorganic substrates in a permanent mannerFRAUNHOFER GES ZUR FOERDERUNGD·Filed 1997·Granted Dec 11, 2001·13 cites·16 claims
- 1742US9978626B2Carrier wafer, method for holding a flexible substrate and method for the manufacture of a carrier waferFRAUNHOFER GES FORSCHUNG·Filed 2015·Granted May 22, 2018·0 cites·22 claims
- 1833US2015332944A1Carrier substrate and method for fixing a substrate structureFRAUNHOFER GES FORSCHUNG·Filed 2015·Application pending·0 cites
- 1932US2018035548A1Patterned layer compoundFRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E V·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →