Inventor · disambiguated record
James Wittman Babcock
Also filed as: BABCOCK JAMES W · BABCOCK JAMES WITTMAN
32 granted patents·2 pending applications·682 citations·filing 1989–2023
98Inventor score
Top patents by PatentIndex Score
34 records- 0190US5821505ATemperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sinkUNISYS CORP·Filed 1997·Granted Oct 13, 1998·112 cites·16 claims
- 0288US9010188B2System and method for accelerating a deviceTUSTANIWSKYJ JERRY IHOR·Filed 2011·Granted Apr 21, 2015·9 cites·26 claims
- 0388US6774661B1Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed jointUNISYS CORP·Filed 2003·Granted Aug 10, 2004·37 cites·15 claims
- 0485US9500701B2Alignment mechanismTUSTANIWSKYJ JERRY IHOR·Filed 2011·Granted Nov 22, 2016·6 cites·22 claims
- 0584US12140625B2Alignment mechanismDELTA DESIGN INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0683US7243704B2Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable endDELTA DESIGN INC·Filed 2004·Granted Jul 17, 2007·31 cites·14 claims
- 0783US5844208ATemperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperatureUNISYS CORP·Filed 1997·Granted Dec 1, 1998·68 cites·14 claims
- 0880US9733151B2System and method for accelerating a deviceDELTA DESIGN INC·Filed 2015·Granted Aug 15, 2017·2 cites·20 claims
- 0979US5918665AMethod of thermal coupling an electronic device to a heat exchange member while said electronic device is being testedUNISYS CORP·Filed 1998·Granted Jul 6, 1999·47 cites·5 claims
- 1078US6914446B1Chip tester having a heat-exchanger with an extendable period of operationUNISYS CORP·Filed 2003·Granted Jul 5, 2005·20 cites·15 claims
- 1177US7199597B2Dual feedback control system for maintaining the temperature of an IC-chip near a set-pointDELTA DESIGN INC·Filed 2004·Granted Apr 3, 2007·19 cites·16 claims
- 1273US6809543B1Abrupt power change method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed jointUNISYS CORP·Filed 2003·Granted Oct 26, 2004·16 cites·17 claims
- 1371US6307388B1Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed togetherUNISYS CORP·Filed 2000·Granted Oct 23, 2001·17 cites·12 claims
- 1470US11802908B2Alignment mechanismDELTA DESIGN INC·Filed 2020·Granted Oct 31, 2023·0 cites·28 claims
- 1570US7004243B1Method of extending the operational period of a heat-exchanger in a chip testerUNISYS CORP·Filed 2003·Granted Feb 28, 2006·23 cites·13 claims
- 1669US7373967B1Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduitsDELTA DESIGN INC·Filed 2004·Granted May 20, 2008·15 cites·14 claims
- 1768US6412551B1System for regulating the temperature of IC-chips with a fluid which is heated and cooled as a function of the fluid temperatures to and from heat exchangers for the IC-chipsUNISYS CORP·Filed 2000·Granted Jul 2, 2002·19 cites·11 claims
- 1868US6362944B1System for regulating the temperature of IC-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heaterUNISYS CORP·Filed 2000·Granted Mar 26, 2002·19 cites·11 claims
- 1967US6995980B2Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-moduleUNISYS CORP·Filed 2003·Granted Feb 7, 2006·12 cites·13 claims
- 2066US7224586B2Method of maintaining an IC-module near a set-pointDELTA DESIGN INC·Filed 2006·Granted May 29, 2007·4 cites·20 claims
- 2165US7310230B2Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressureDELTA DESIGN INC·Filed 2003·Granted Dec 18, 2007·10 cites·31 claims
- 2263US6116331AMechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profileUNISYS CORP·Filed 1998·Granted Sep 12, 2000·29 cites·14 claims
- 2363US4980002AMethod of fabricating a layered electronic assembly having compensation for chips of different thickness and different I/O lead offsetsUNISYS CORP·Filed 1989·Granted Dec 25, 1990·29 cites·12 claims
- 2461US4959749ALayered electronic assembly having compensation for chips of different thickness and different I/O lead offsetsUNISYS CORP·Filed 1989·Granted Sep 25, 1990·27 cites·12 claims
- 2559US6822465B1Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agentUNISYS CORP·Filed 2002·Granted Nov 23, 2004·8 cites·8 claims
- 2658US6108208ATesting assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modulesUNISYS CORP·Filed 1997·Granted Aug 22, 2000·23 cites·7 claims
- 2756US6179047B1Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profileUNISYS CORP·Filed 1998·Granted Jan 30, 2001·20 cites·14 claims
- 2855US8628240B2Temperature measurement using a diode with saturation current cancellationTUSTANIWSKYJ JERRY IHOR·Filed 2009·Granted Jan 14, 2014·2 cites·34 claims
- 2955US2017067960A1Alignment mechanismDELTA DESIGN INC·Filed 2016·Application pending·0 cites
- 3054US4999311AMethod of fabricating interconnections to I/O leads on layered electronic assembliesUNISYS CORP·Filed 1989·Granted Mar 12, 1991·20 cites·13 claims
- 3152US6658736B1Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agentUNISYS CORP·Filed 2002·Granted Dec 9, 2003·5 cites·17 claims
- 3250US6243944B1Residue-free method of assembling and disassembling a pressed joint with low thermal resistanceUNISYS CORP·Filed 1997·Granted Jun 12, 2001·16 cites·10 claims
- 3350US6196299B1Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its cornersUNISYS CORP·Filed 1998·Granted Mar 6, 2001·17 cites·16 claims
- 3438US2017027084A1Continuous fluidic thermal interface material dispensingDELTA DESIGN INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →