Inventor · disambiguated record
Lawrence William Friedrich
Also filed as: FRIEDRICH LAWRENCE WILLIAM
3 granted patents·53 citations·filing 1998–2000
72Inventor score
Files withUNISYS CORP3
Top patents by PatentIndex Score
3 records- 0172US6522156B2Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chipsUNISYS CORP·Filed 2000·Granted Feb 18, 2003·19 cites·9 claims
- 0271US6307388B1Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed togetherUNISYS CORP·Filed 2000·Granted Oct 23, 2001·17 cites·12 claims
- 0350US6196299B1Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its cornersUNISYS CORP·Filed 1998·Granted Mar 6, 2001·17 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →