Inventor · disambiguated record
Karl G. Hoebener
Also filed as: HOEBENER KARL G · HOEBENER KARL GRANT
13 granted patents·1,494 citations·filing 1986–1997
95Inventor score
Top patents by PatentIndex Score
13 records- 0197US5492266AFine pitch solder deposits on printed circuit board process and productIBM·Filed 1994·Granted Feb 20, 1996·195 cites·13 claims
- 0295US5591941ASolder ball interconnected assemblyIBM·Filed 1993·Granted Jan 7, 1997·183 cites·28 claims
- 0393US5699613AFine dimension stacked vias for a multiple layer circuit board structureIBM·Filed 1995·Granted Dec 23, 1997·200 cites·10 claims
- 0492US5758413AMethod of manufacturing a multiple layer circuit board die carrier with fine dimension stacked viasIBM·Filed 1996·Granted Jun 2, 1998·159 cites·3 claims
- 0592US5147084AInterconnection structure and test methodIBM·Filed 1991·Granted Sep 15, 1992·175 cites·14 claims
- 0692US5060844AInterconnection structure and test methodIBM·Filed 1990·Granted Oct 29, 1991·184 cites·15 claims
- 0790US5762259AMethod for forming bumps on a substrateMOTOROLA INC·Filed 1997·Granted Jun 9, 1998·88 cites·20 claims
- 0890US4761881ASingle step solder processIBM·Filed 1986·Granted Aug 9, 1988·94 cites·2 claims
- 0986US5675889ASolder ball connections and assembly processIBM·Filed 1995·Granted Oct 14, 1997·77 cites·20 claims
- 1077US6504105B1Solder ball connections and assembly processIBM·Filed 1996·Granted Jan 7, 2003·44 cites·2 claims
- 1176US5825629APrint circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachmentIBM·Filed 1996·Granted Oct 20, 1998·37 cites·1 claims
- 1271US4919970ASolder deposition controlIBM·Filed 1986·Granted Apr 24, 1990·28 cites·7 claims
- 1368US4998342AMethod of attaching electronic componentsIBM·Filed 1989·Granted Mar 12, 1991·30 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →