Inventor · disambiguated record
Shinetsu Fujieda
Also filed as: FUJIEDA SHINETSU
35 granted patents·11 pending applications·806 citations·filing 1985–2014
97Inventor score
Top patents by PatentIndex Score
46 records- 0198US5641997APlastic-encapsulated semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jun 24, 1997·442 cites·20 claims
- 0288US7982190B2Radiation detector and method for producing the sameTOSHIBA ELECTRON TUBES & DEVIC·Filed 2010·Granted Jul 19, 2011·10 cites·16 claims
- 0384US5223739APlastic molded semiconductor device having waterproof capTOSHIBA KK·Filed 1990·Granted Jun 29, 1993·82 cites·6 claims
- 0480US8354022B2Adsorbent, method for recovering an organic matter and method for recovering an oilTOSHIBA KK·Filed 2010·Granted Jan 15, 2013·3 cites·20 claims
- 0578US8540883B2Polymer composite, water-treatment method using the same and manufacturing method of the sameFUKAYA TARO·Filed 2012·Granted Sep 24, 2013·2 cites·8 claims
- 0677US8221622B2Polymer composite, water-treatment method using the same and manufacturing method of the sameFUKAYA TARO·Filed 2009·Granted Jul 17, 2012·7 cites·13 claims
- 0775US8603341B2Oil adsorbent, and method for recovering oilFUKAYA TARO·Filed 2011·Granted Dec 10, 2013·2 cites·15 claims
- 0869US6437090B1Curing catalyst, resin composition, resin-sealed semiconductor device and coating materialTOSHIBA KK·Filed 1999·Granted Aug 20, 2002·21 cites·16 claims
- 0967US9223032B2Composition for reflective film, reflective film, and X-ray detectorTOSHIBA ELECTRON TUBES & DEVIC·Filed 2014·Granted Dec 29, 2015·0 cites·14 claims
- 1067US8512570B2Wastewater treatment methodFUKAYA TARO·Filed 2012·Granted Aug 20, 2013·2 cites·8 claims
- 1167US4719255AEpoxy resin composition for encapsulation of semi-conductor deviceTOSHIBA KK·Filed 1985·Granted Jan 12, 1988·22 cites·13 claims
- 1266US5998509AResin composition and semiconductor device employing the sameTOSHIBA KK·Filed 1997·Granted Dec 7, 1999·32 cites·25 claims
- 1365US9108865B2Method for treating boron-containing waterIMADA TOSHIHIRO·Filed 2012·Granted Aug 18, 2015·1 cites·17 claims
- 1464US5272377AMaleimide resin composition and resin encapsulated semiconductor device manufactured using the compositionTOSHIBA KK·Filed 1991·Granted Dec 21, 1993·34 cites·12 claims
- 1563US4916174ARubber-modified phenolic resin composition and method of manufacturing the sameTOSHIBA KK·Filed 1988·Granted Apr 10, 1990·17 cites·8 claims
- 1662US5043211AEpoxy resin composition and a resin-sealed semiconductor deviceTOSHIBA KK·Filed 1988·Granted Aug 27, 1991·26 cites·8 claims
- 1761US5216077ARubber-modified phenolic resin composition and method of manufacturing the sameTOSHIBA KK·Filed 1992·Granted Jun 1, 1993·17 cites·4 claims
- 1860US9158006B2Composition for reflective film, reflective film, and X-ray detectorFUJIEDA SHINETSU·Filed 2009·Granted Oct 13, 2015·0 cites·14 claims
- 1960US5258426ASemiconductor device encapsulantTOSHIBA KK·Filed 1990·Granted Nov 2, 1993·29 cites·18 claims
- 2057US7026379B2Copolymer resin composition and production process thereofTOSHIBA KK·Filed 2002·Granted Apr 11, 2006·7 cites·19 claims
- 2156US8258076B2Phosphorus compound adsorbent, phosphorus compound adsorption system, and method of using phosphorus compound adsorbentSUZUKI AKIKO·Filed 2008·Granted Sep 4, 2012·1 cites·6 claims
- 2256US8133838B2Water purification materialTSUJI HIDEYUKI·Filed 2009·Granted Mar 13, 2012·0 cites·4 claims
- 2356US5912320APolyphenylene sulfide resin composition and resin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 15, 1999·20 cites·18 claims
- 2456US2009230570A1Resin composition and semiconductor device empolying the sameFUKAYA TARO·Filed 2009·Application pending·0 cites
- 2553US8809228B2Oil adsorbent and method of manufacturing oil adsorbentFUKAYA TARO·Filed 2012·Granted Aug 19, 2014·0 cites·16 claims
- 2653US2009321363A1Functional particles and water treatment method employing the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 2753US2010059448A1Magnetic particles for water purification and water treatment method employing the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 2853US2009314717A1Oil-adsorbing particle composite and water-treatment method using the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 2951US7141647B2Image file arrangement for use with an improved image quality assurance systemTOSHIBA KK·Filed 2004·Granted Nov 28, 2006·1 cites·21 claims
- 3050US8470731B2Oil adsorbent, and method for recovering the sameFUKAYA TARO·Filed 2010·Granted Jun 25, 2013·0 cites·17 claims
- 3150US7901582B2Phosphorus recovery method and phosphorus recovery systemTOSHIBA KK·Filed 2009·Granted Mar 8, 2011·0 cites·8 claims
- 3249US5346743AResin encapsulation type semiconductor deviceTOSHIBA KK·Filed 1993·Granted Sep 13, 1994·17 cites·20 claims
- 3349US2008302970A1Radiation ray detectorTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3448US8680164B2Method for recovering a boron adsorbentYAMADA ARISA·Filed 2012·Granted Mar 25, 2014·0 cites·8 claims
- 3548US7138435B2Method of decomposing thermosetting resin, apparatus and heat control programTOSHIBA KK·Filed 2001·Granted Nov 21, 2006·1 cites·17 claims
- 3647US7838311B2Process for producing light-emitting semiconductor deviceTOSHIBA KK·Filed 2008·Granted Nov 23, 2010·0 cites·6 claims
- 3746US2005048347A1Separator for fuel cell, end plate for fuel cell, and fuel cell power generation apparatusFiled 2004·Application pending·0 cites
- 3845US8158949B2Radiation detector and method for manufacturing the sameHOMMA KATSUHISA·Filed 2010·Granted Apr 17, 2012·0 cites·11 claims
- 3945US5438113AThermosetting resin compositionTOSHIBA KK·Filed 1993·Granted Aug 1, 1995·6 cites·10 claims
- 4045US2008303044A1Semiconductor light-emitting deviceTOSHIBA KK·Filed 2008·Application pending·0 cites
- 4143US2005010025A1Resin composition and manufacturing method thereofTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4238US2007045554A1Radiation detectorTOSHIBA ELECTRON TUBES & DEVIC·Filed 2006·Application pending·0 cites
- 4337US5637667AThermosetting resin compositionTOSHIBA KK·Filed 1995·Granted Jun 10, 1997·4 cites·11 claims
- 4437US2004143085A1Method for processing urethane resin, decomposed substance of urethane resin, recycled resin and method for producing the sameTOSHIBA KK·Filed 2003·Application pending·0 cites
- 4535US2004183215A1Electronic device using coating epoxy resin compositionTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4629US5252639AMolding resin composition and molded electronic componentTOSHIBA KK·Filed 1991·Granted Oct 12, 1993·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →