Inventor · disambiguated record
Wei-Min Chen
Also filed as: CHEN WEI · Chen wei min
11 granted patents·7 pending applications·131 citations·filing 1996–2025
87Inventor score
Files withAPPLIED MATERIALS INC3QUEEN CERAMIC INC3Chen wei min2MACRONIX INT CO LTD2SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD2
Top patents by PatentIndex Score
18 records- 0186US5834068AWafer surface temperature control for deposition of thin filmsAPPLIED MATERIALS INC·Filed 1996·Granted Nov 10, 1998·73 cites·14 claims
- 0283US8536684B2Method of assembling shielded integrated circuit deviceChen wei min·Filed 2011·Granted Sep 17, 2013·8 cites·12 claims
- 0377US12326312B1Bullpup conversion kit and gun including the sameChen wei min·Filed 2024·Granted Jun 10, 2025·1 cites·17 claims
- 0473US12000044B2Catalyzed deposition of metal filmsAPPLIED MATERIALS INC·Filed 2019·Granted Jun 4, 2024·1 cites·20 claims
- 0570US9423912B2Touch panelTPK HOLDING CO LTD·Filed 2013·Granted Aug 23, 2016·4 cites·8 claims
- 0664US6471464B1Wafer positioning deviceAPPLIED MATERIALS INC·Filed 1999·Granted Oct 29, 2002·36 cites·16 claims
- 0763US8096211B2Digital power torque wrench of indirect transmissionCHO CHIH-HUA·Filed 2008·Granted Jan 17, 2012·8 cites·19 claims
- 0860US2024105377A1Magnetic structure and magnetic elementSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 0958US2025107077A1Semiconductor deviceMACRONIX INT CO LTD·Filed 2023·Application pending·0 cites
- 1054US12252448B1Engineered stone and manufacturing method thereofQUEEN CERAMIC INC·Filed 2024·Granted Mar 18, 2025·0 cites·8 claims
- 1154US10443695B2Linear actuatorHIWIN MIKROSYSTEM CORP·Filed 2017·Granted Oct 15, 2019·0 cites·5 claims
- 1253US2024074052A1Integrated substrate and power integrated circuitSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2023·Application pending·0 cites
- 1352US11686658B2Friction and wear test device with pin-on-plate differential temperature distribution and self-adaptive adjustmentUNIV JIANGSU·Filed 2021·Granted Jun 27, 2023·0 cites·5 claims
- 1450US2025243111A1Engineered stone and manufacturing method thereofQUEEN CERAMIC INC·Filed 2024·Application pending·0 cites
- 1544US8541870B1Semiconductor package utilizing tape to reinforce fixing of leads to die padPOWERTECH TECHNOLOGY INC·Filed 2012·Granted Sep 24, 2013·0 cites·10 claims
- 1640US2025206663A1Engineered stoneQUEEN CERAMIC INC·Filed 2025·Application pending·0 cites
- 1739US2019206732A1Three-dimensional semiconductor device and method for manufacturing the sameMACRONIX INT CO LTD·Filed 2017·Application pending·0 cites
- 1837US2011108967A1Semiconductor chip grid array package and method for fabricating sameFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →