Inventor · disambiguated record
Seongwon Jeong
Also filed as: JEONG SEONGWON
3 granted patents·1 pending application·0 citations·filing 2020–2022
44Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0164US11784139B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·16 claims
- 0258US11342283B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·15 claims
- 0347US2023130436A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0445US11640950B2Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →