Inventor · disambiguated record
Beng Chye Chew
Also filed as: CHEW BENG CHYE
12 granted patents·1 pending application·151 citations·filing 2002–2013
93Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC13
Top patents by PatentIndex Score
13 records- 0197US7309623B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 18, 2007·45 cites·23 claims
- 0293US7282390B2Stacked die-in-die BGA package with die having a recessMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·19 cites·20 claims
- 0387US7282392B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·8 cites·21 claims
- 0486US7799610B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 21, 2010·7 cites·25 claims
- 0584US8373277B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 12, 2013·6 cites·7 claims
- 0682US7358117B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 15, 2008·5 cites·36 claims
- 0781US7332820B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 19, 2008·16 cites·84 claims
- 0880US7332819B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 19, 2008·16 cites·67 claims
- 0979US7575953B2Stacked die with a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 18, 2009·4 cites·22 claims
- 1078US7344969B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·13 cites·70 claims
- 1176US7371608B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted May 13, 2008·12 cites·42 claims
- 1258US2013154117A1Stacked die in die bga packageMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1348US7691680B2Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →