Inventor · disambiguated record
Dorab Bhagwagar
Also filed as: BHAGWAGAR DORAB · BHAGWAGAR DORAB E · BHAGWAGAR DORAB EDUL
22 granted patents·18 pending applications·463 citations·filing 2000–2022
95Inventor score
Files withDOW SILICONES CORP14DOW CORNING11DOW GLOBAL TECHNOLOGIES LLC5BHAGWAGAR DORAB3AHN DONGCHAN1
Top patents by PatentIndex Score
40 records- 0198US6791839B2Thermal interface materials and methods for their preparation and useDOW CORNING·Filed 2002·Granted Sep 14, 2004·128 cites·17 claims
- 0296US6783692B2Heat softening thermally conductive compositions and methods for their preparationDOW CORNING·Filed 2002·Granted Aug 31, 2004·88 cites·28 claims
- 0394US6433057B1Silicone composition and electrically conductive silicone adhesive formed therefromDOW CORNING·Filed 2000·Granted Aug 13, 2002·54 cites·20 claims
- 0493US6815486B2Thermally conductive phase change materials and methods for their preparation and useDOW CORNING·Filed 2002·Granted Nov 9, 2004·73 cites·26 claims
- 0592US9598575B2High temperature stable thermally conductive materialsBHAGWAGAR DORAB·Filed 2012·Granted Mar 21, 2017·40 cites·17 claims
- 0690US10000680B2High temperature stable thermally conductive materialsDOW CORNING·Filed 2017·Granted Jun 19, 2018·5 cites·17 claims
- 0789US10155858B2Curable composition, cured product formed from the curable composition, and method of forming the cured productDOW CORNING·Filed 2015·Granted Dec 18, 2018·2 cites·14 claims
- 0889US8618211B2Thermally conductive grease and methods and devices in which said grease is usedBHAGWAGAR DORAB EDUL·Filed 2010·Granted Dec 31, 2013·24 cites·16 claims
- 0987US9963546B2Fluorinated compound, curable composition comprising same, and cured productDOW CORNING·Filed 2015·Granted May 8, 2018·2 cites·13 claims
- 1085US7687591B2Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strengthDOW CORNING·Filed 2004·Granted Mar 30, 2010·23 cites·8 claims
- 1183US8334592B2Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and useBHAGWAGAR DORAB·Filed 2008·Granted Dec 18, 2012·15 cites·43 claims
- 1282US11485861B2Method for applying thermally conductive composition on electronic componentsDOW SILICONES CORP·Filed 2018·Granted Nov 1, 2022·2 cites·7 claims
- 1381US9227183B2Microparticles and curable organopolysiloxane composition containing the sameDOW CORNING TORAY CO LTD·Filed 2013·Granted Jan 5, 2016·3 cites·16 claims
- 1478US9752007B2Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the compositionDOW CORNING·Filed 2013·Granted Sep 5, 2017·3 cites·18 claims
- 1563US2025026930A1Room temperature storable one-part post curable thermally conductive silicone with vertical stabilityDOW SILICONES CORP·Filed 2021·Application pending·0 cites
- 1662US11655369B2Trialkoxy functional branched siloxane compositionsDOW SILICONES CORP·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 1760US12454614B2Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cureDOW GLOBAL TECHNOLOGIES LLC·Filed 2020·Granted Oct 28, 2025·0 cites·10 claims
- 1860US2024141112A1Curable polyolefin composition and cured productHE CHAO·Filed 2021·Application pending·0 cites
- 1960US2023313016A1Aluminum nitride filled thermally conductive silicone compositionDOW SILICONES CORP·Filed 2020·Application pending·0 cites
- 2058US11021607B2Metal-polyorganosiloxanesDOW SILICONES CORP·Filed 2017·Granted Jun 1, 2021·1 cites·17 claims
- 2158US2024174907A1Curable polyolefin composition and cured productDOW GLOBAL TECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 2257US12503599B2Thermal conductive silicone compositionDOW SILICONES CORP·Filed 2020·Granted Dec 23, 2025·0 cites·14 claims
- 2357US12359038B2Highly thermally conductive flowable silicone compositionDOW SILICONES CORP·Filed 2019·Granted Jul 15, 2025·0 cites·10 claims
- 2456US2024318000A1Thermal conductive silicone compositionDOW SILICONES CORP·Filed 2021·Application pending·0 cites
- 2555US2022372244A1Flame retardant polysiloxane compositionDOW SILICONES CORP·Filed 2019·Application pending·0 cites
- 2653US2006014915A1Silicones having improved surface properties and curable silicone compositions for preparing the siliconesAHN DONGCHAN·Filed 2005·Application pending·0 cites
- 2752US2025353965A1Curable silicone composition and cured product thereofDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2852US2025129281A1Curable thermally conductive compositionDOW SILICONES CORP·Filed 2022·Application pending·0 cites
- 2949US2021403716A1Thermally conductive composition containing mgo filler and methods and devices in which said composition is usedDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Application pending·0 cites
- 3048US2005038183A1Silicones having improved surface properties and curable silicone compositions for preparing the siliconesFiled 2003·Application pending·0 cites
- 3148US2013344632A1Thermal Management Within an LED AssemblyBECKER GREGORY·Filed 2012·Application pending·0 cites
- 3246US11851603B2Thermally conductive composition and methods and devices in which said composition is usedDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Granted Dec 26, 2023·0 cites·13 claims
- 3346US11732175B2Non-curable thermally conductive pituitous silicone materialDOW SILICONES CORP·Filed 2020·Granted Aug 22, 2023·0 cites·10 claims
- 3446US2024279525A1Thermally conductive silicone compositionDOW SILICONES CORP·Filed 2021·Application pending·0 cites
- 3546US2024059946A1Thermal interface materialDOW GLOBAL TECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
- 3644US12503601B2Curable thermally conductive polysiloxane composition with increased thixotropic indexDOW SILICONES CORP·Filed 2020·Granted Dec 23, 2025·0 cites·9 claims
- 3743US2010328895A1Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and UseBHAGWAGAR DORAB·Filed 2008·Application pending·0 cites
- 3839US2016197025A1Method of Fabricating an Electronic DeviceDOW CORNING·Filed 2013·Application pending·0 cites
- 3935US2015130086A1Gel Having Improved Thermal StabilityDOW COMING CORP·Filed 2012·Application pending·0 cites
- 4031US2018009997A1Hardcoat and related compositions, methods, and articlesDOW CORNING·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →