Inventor · disambiguated record
Hsin-Chiang Lin
Also filed as: LIN HSIN-CHIANG
27 granted patents·19 pending applications·577 citations·filing 1999–2019
94Inventor score
Files withADVANCED OPTOELECTRONIC TECH21LIN HSIN-CHIANG13CHEN PIN-CHUAN6TECAN TRADING AG2CHEN LI-HSIANG1
Top patents by PatentIndex Score
46 records- 0197US6706519B1Devices and methods for the performance of miniaturized in vitro amplification assaysTECAN TRADING AG·Filed 2000·Granted Mar 16, 2004·314 cites·30 claims
- 0293US6632399B1Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system for performing biological fluid assaysTECAN TRADING AG·Filed 1999·Granted Oct 14, 2003·242 cites·16 claims
- 0380US8569080B2Method for packaging light emitting diodeCHEN LI-HSIANG·Filed 2012·Granted Oct 29, 2013·6 cites·12 claims
- 0476US8373189B2Light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Feb 12, 2013·4 cites·13 claims
- 0573US8945959B2LED with thin package struture and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 3, 2015·3 cites·11 claims
- 0672US8748200B2Method for manufacturing LED packageADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 10, 2014·1 cites·3 claims
- 0771US8455274B2Method for manufacturing light emitting diodeCHEN PIN-CHUAN·Filed 2011·Granted Jun 4, 2013·3 cites·17 claims
- 0865US8476664B2Light emitting diode package having multiple luminescent conversion layersLIN HSIN-CHIANG·Filed 2011·Granted Jul 2, 2013·2 cites·15 claims
- 0964US10890802B2Optical lens, backlight module and display device using sameADVANCED OPTOELECTRONIC TECH·Filed 2019·Granted Jan 12, 2021·0 cites·14 claims
- 1062US8569791B2LED and method for manufacturing the sameCHEN PIN-CHUAN·Filed 2011·Granted Oct 29, 2013·1 cites·10 claims
- 1160US8981419B2LedADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·0 cites·1 claims
- 1260US8735933B2Light emitting diode package and method of manufacturing the sameLIN HSIN-CHIANG·Filed 2012·Granted May 27, 2014·1 cites·4 claims
- 1356US8513695B2LED package and method for making the sameLIN HSIN-CHIANG·Filed 2011·Granted Aug 20, 2013·0 cites·7 claims
- 1456US8492180B2LED and method for manufacturing the sameLIN HSIN-CHIANG·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
- 1554US8835198B2Method for manufacturing LEDADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 16, 2014·0 cites·8 claims
- 1652US8633507B2LED with versatile mounting waysLIN HSIN-CHIANG·Filed 2012·Granted Jan 21, 2014·0 cites·17 claims
- 1751US2010070064A1Method and system for configuring high cri ledADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 1851US2010090935A1Method and system for configuring high cri ledADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 1950US10133133B1Liquid crystal display baseADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Nov 20, 2018·0 cites·10 claims
- 2050US2004259237A1Devices and methods for the performance of miniaturized in vitro amplification assaysFiled 2004·Application pending·0 cites
- 2149US8535960B2Method for packaging light emitting diode having fluorescent material directly coated on LED die thereofCHEN PIN-CHUAN·Filed 2012·Granted Sep 17, 2013·0 cites·10 claims
- 2248US8816385B2Light emitting diode package and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Aug 26, 2014·0 cites·20 claims
- 2347US2013288409A1Method for manufacturing light emitting diodeINC ADVANCED OPTOELECTRONIC TECHNOLOGY·Filed 2012·Application pending·0 cites
- 2447US2013264603A1Surface-mounting led chipADVANCED OPTOELECTRONIC TECH·Filed 2012·Application pending·0 cites
- 2546US2004089616A1Devices and methods for using centripetal acceleration to drive fluid movement in a microfluidics system for performing biological fluid assaysFiled 2003·Application pending·0 cites
- 2646US2013020607A1Led module and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2011·Application pending·0 cites
- 2746US2020365783A1Packaging structure of light emitting diodeADVANCED OPTOELECTRONIC TECH·Filed 2019·Application pending·0 cites
- 2845US10705376B2Liquid crystal display deviceADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Jul 7, 2020·0 cites·15 claims
- 2945US8896009B2Light emitting diode with two alternative mounting sides for mounting on circuit boardADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Nov 25, 2014·0 cites·12 claims
- 3044US8846422B2Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange strutureADVANCED OPTOELECTRONIC TECH·Filed 2012·Granted Sep 30, 2014·0 cites·20 claims
- 3144US2019033658A1Liquid crystal display moduleADVANCED OPTOELECTRONIC TECH·Filed 2017·Application pending·0 cites
- 3244US2020373466A1Light source device and display using the sameADVANCED OPTOELECTRONIC TECH·Filed 2019·Application pending·0 cites
- 3342US10222024B2Lens for light emitting deviceADVANCED OPTOELECTRONIC TECH·Filed 2016·Granted Mar 5, 2019·0 cites·15 claims
- 3442US8883533B2Method for manufacturing light emitting diode packageLIN HSIN-CHIANG·Filed 2012·Granted Nov 11, 2014·0 cites·18 claims
- 3542US2013069101A1Method for manufacturing led and led obtained therebyLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 3641US9786642B1Light emitting diode package substrate and light emitting diode package elementADVANCED OPTOELECTRONIC TECH·Filed 2016·Granted Oct 10, 2017·0 cites·9 claims
- 3741US9123870B2LED package structureLIN HSIN-CHIANG·Filed 2011·Granted Sep 1, 2015·0 cites·9 claims
- 3841US2013234184A1Light emitting diode package and method of manufacturing the sameCHEN PIN-CHUAN·Filed 2012·Application pending·0 cites
- 3940US8664018B2Manufacturing method for LED packageLIN HSIN-CHIANG·Filed 2011·Granted Mar 4, 2014·0 cites·12 claims
- 4040US2013168709A1Light emitting diode device with multiple light emitting diodesLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 4140US2013069092A1Light-emitting diode and method manufacturing the sameCHEN PIN-CHUAN·Filed 2012·Application pending·0 cites
- 4240US2013065332A1Method for manufacturing led with an encapsulant having a flat top faceLIN HSIN-CHIANG·Filed 2012·Application pending·0 cites
- 4339US2012187436A1Light emitting diode device and manufacturing method thereofCHEN PIN-CHUAN·Filed 2011·Application pending·0 cites
- 4439US2012211786A1Led package structure with a wide optical fieldLIN HSIN-CHIANG·Filed 2011·Application pending·0 cites
- 4538US2012280262A1Semiconductor light emitting device and method for manufacturing thereofLIN HSIN-CHIANG·Filed 2011·Application pending·0 cites
- 4636US2014319565A1Light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →