Inventor · disambiguated record
Jochen Heber
Also filed as: HEBER JOCHEN
6 granted patents·5 pending applications·74 citations·filing 2001–2011
82Inventor score
Top patents by PatentIndex Score
11 records- 0188US6773568B2Metal alloy compositions and plating methods related theretoSHIPLEY CO LLC·Filed 2003·Granted Aug 10, 2004·25 cites·14 claims
- 0286US6706418B2Metal alloy compositions and plating methods related theretoSHIPLEY CO LLC·Filed 2001·Granted Mar 16, 2004·21 cites·17 claims
- 0383US7465385B2Gold alloy electrolytesROHM & HAAS ELECT MAT·Filed 2006·Granted Dec 16, 2008·5 cites·8 claims
- 0475US6824597B2Stabilizers for electroless plating solutions and methods of use thereofSHIPLEY CO LLC·Filed 2002·Granted Nov 30, 2004·20 cites·20 claims
- 0563US2009104463A1Gold alloy electrolytesROHM & HAAS ELECT MAT·Filed 2008·Application pending·0 cites
- 0657US7122108B2Tin-silver electrolyteSHIPLEY CO LLC·Filed 2003·Granted Oct 17, 2006·3 cites·17 claims
- 0756US8142637B2Gold alloy electrolytesEGLI ANDRE·Filed 2011·Granted Mar 27, 2012·0 cites·3 claims
- 0851US2007037005A1Tin-silver electrolyteSHIPLEY CO LLC·Filed 2006·Application pending·0 cites
- 0942US2002187364A1Tin platingSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 1035US2004118696A1Tin plating methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1132US2012244276A1Method for depositing a palladium layer suitable for wire bonding on conductors of a printed circuit board, and palladium bath for use in said methodHEBER JOCHEN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →