Inventor · disambiguated record
Tzu-Cheng Lin
Also filed as: LIN TZU-CHENG
12 granted patents·6 pending applications·35 citations·filing 2008–2024
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8ADVANCED SEMICONDUCTOR ENG2INOTERA MEMORIES INC2LIN TZU CHENG2MOXA INC1
Top patents by PatentIndex Score
18 records- 0195US11302646B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 12, 2022·5 cites·14 claims
- 0290US11626304B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0387US12176297B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 24, 2024·1 cites·17 claims
- 0487US10964566B2Machine learning on overlay virtual metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·4 cites·20 claims
- 0586US7773378B2Heat-dissipating structure for expansion board architectureMOXA INC·Filed 2008·Granted Aug 10, 2010·20 cites·17 claims
- 0677US12237188B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0776US2025123572A1Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0865US12197138B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 0965US9390491B2System and method for automatic quality control for assembly line processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 12, 2016·2 cites·18 claims
- 1057US2025087592A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1155US2024387447A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1253US8964394B2Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic componentsLIN TZU CHENG·Filed 2012·Granted Feb 24, 2015·1 cites·7 claims
- 1345US2013024019A1Apparatus and methods for end point determination in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 1444US2009197354A1System and method for monitoring manufacturing processINOTERA MEMORIES INC·Filed 2008·Application pending·0 cites
- 1544US2009326449A1Control apparatus of catheter feederUNIV NAT TAIWAN·Filed 2008·Application pending·0 cites
- 1642US8010212B2Fuzzy control method for adjusting a semiconductor machineINOTERA MEMORIES INC·Filed 2008·Granted Aug 30, 2011·0 cites·22 claims
- 1740US8445296B2Apparatus and methods for end point determination in reactive ion etchingWANG CHIEN RHONE·Filed 2011·Granted May 21, 2013·0 cites·15 claims
- 1835US8640968B2Temperature gain control device and method thereofLIN TZU CHENG·Filed 2010·Granted Feb 4, 2014·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →