Inventor · disambiguated record
Gary Bultman
Also filed as: BULTMAN GARY
26 granted patents·2 pending applications·2,202 citations·filing 2001–2014
98Inventor score
Files withKLA TENCOR TECH CORP19KLA TENCOR TECHNOLOGIES3KLA TENCOR INC2LEVY ADY2K L A TENCOR TECHNOLOGIES1
Top patents by PatentIndex Score
28 records- 0199US6633831B2Methods and systems for determining a critical dimension and a thin film characteristic of a specimenKLA TENCOR TECHNOLOGIES·Filed 2001·Granted Oct 14, 2003·362 cites·82 claims
- 0298US6891627B1Methods and systems for determining a critical dimension and overlay of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted May 10, 2005·192 cites·100 claims
- 0398US6694284B1Methods and systems for determining at least four properties of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Feb 17, 2004·211 cites·61 claims
- 0497US8179530B2Methods and systems for determining a critical dimension and overlay of a specimenLEVY ADY·Filed 2010·Granted May 15, 2012·143 cites·24 claims
- 0597US6812045B1Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantationKLA TENCOR INC·Filed 2001·Granted Nov 2, 2004·97 cites·52 claims
- 0697US6673637B2Methods and systems for determining a presence of macro defects and overlay of a specimenKLA TENCOR TECHNOLOGIES·Filed 2001·Granted Jan 6, 2004·120 cites·83 claims
- 0796US7751046B2Methods and systems for determining a critical dimension and overlay of a specimenKLA TENCOR TECH CORP·Filed 2003·Granted Jul 6, 2010·79 cites·13 claims
- 0896US7139083B2Methods and systems for determining a composition and a thickness of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Nov 21, 2006·68 cites·62 claims
- 0996US6917433B2Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch processKLA TENCOR TECH CORP·Filed 2001·Granted Jul 12, 2005·61 cites·56 claims
- 1096US6806951B2Methods and systems for determining at least one characteristic of defects on at least two sides of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Oct 19, 2004·65 cites·74 claims
- 1195US8502979B2Methods and systems for determining a critical dimension and overlay of a specimenLEVY ADY·Filed 2012·Granted Aug 6, 2013·24 cites·8 claims
- 1295US7196782B2Methods and systems for determining a thin film characteristic and an electrical property of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Mar 27, 2007·56 cites·71 claims
- 1395US7006235B2Methods and systems for determining overlay and flatness of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Feb 28, 2006·48 cites·71 claims
- 1495US6950196B2Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimenKLA TENCOR TECH CORP·Filed 2001·Granted Sep 27, 2005·50 cites·73 claims
- 1595US6919957B2Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Jul 19, 2005·110 cites·90 claims
- 1695US6917419B2Methods and systems for determining flatness, a presence of defects, and a thin film characteristic of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Jul 12, 2005·51 cites·88 claims
- 1795US6891610B2Methods and systems for determining an implant characteristic and a presence of defects on a specimenKLA TENCOR TECH CORP·Filed 2001·Granted May 10, 2005·48 cites·87 claims
- 1895US6829559B2Methods and systems for determining a presence of macro and micro defects on a specimenK L A TENCOR TECHNOLOGIES·Filed 2001·Granted Dec 7, 2004·103 cites·80 claims
- 1994US7106425B1Methods and systems for determining a presence of defects and a thin film characteristic of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Sep 12, 2006·71 cites·86 claims
- 2094US6946394B2Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition processKLA TENCOR TECHNOLOGIES·Filed 2001·Granted Sep 20, 2005·43 cites·64 claims
- 2194US6782337B2Methods and systems for determining a critical dimension an a presence of defects on a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Aug 24, 2004·85 cites·83 claims
- 2291US6818459B2Methods and systems for determining a presence of macro defects and overlay of a specimenKLA TENCOR TECH CORP·Filed 2003·Granted Nov 16, 2004·48 cites·47 claims
- 2384US7349090B2Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithographyKLA TENCOR TECH CORP·Filed 2001·Granted Mar 25, 2008·24 cites·9 claims
- 2482US7130029B2Methods and systems for determining an adhesion characteristic and a thickness of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Oct 31, 2006·27 cites·67 claims
- 2580US9818633B2Equipment front end module for transferring wafers and method of transferring wafersLAM RES CORP·Filed 2014·Granted Nov 14, 2017·5 cites·19 claims
- 2680US7460981B2Methods and systems for determining a presence of macro and micro defects on a specimenKLA TENCOR TECH CORP·Filed 2004·Granted Dec 2, 2008·11 cites·79 claims
- 2757US2013314710A1Methods and Systems for Determining a Critical Dimension and Overlay of a SpecimenKLA TENCOR TECH CORP·Filed 2013·Application pending·0 cites
- 2845US2004073398A1Methods and systems for determining a critical dimension and a thin film characteristic of a specimenKLA TENCOR INC·Filed 2003·Application pending·0 cites
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