Inventor · disambiguated record
Sandeep B. Sane
Also filed as: SANE SANDEEP · SANE SANDEEP B
30 granted patents·10 pending applications·272 citations·filing 2002–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US8064224B2Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2008·Granted Nov 22, 2011·155 cites·20 claims
- 0293US11557541B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2018·Granted Jan 17, 2023·6 cites·25 claims
- 0393US8441809B2Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing sameMAHAJAN RAVI·Filed 2011·Granted May 14, 2013·14 cites·7 claims
- 0489US7312527B2Low temperature phase change thermal interface material damINTEL CORP·Filed 2005·Granted Dec 25, 2007·18 cites·22 claims
- 0587US7781260B2Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed therebyINTEL CORP·Filed 2007·Granted Aug 24, 2010·14 cites·14 claims
- 0681US12347783B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0780US9659908B1Systems and methods for package on package through mold interconnectsINTEL CORP·Filed 2015·Granted May 23, 2017·4 cites·20 claims
- 0880US7304391B2Modified chip attach process and apparatusINTEL CORP·Filed 2005·Granted Dec 4, 2007·6 cites·19 claims
- 0980US6919224B2Modified chip attach process and apparatusINTEL CORP·Filed 2003·Granted Jul 19, 2005·19 cites·20 claims
- 1079US9953934B2Warpage controlled package and method for sameINTEL CORP·Filed 2015·Granted Apr 24, 2018·4 cites·35 claims
- 1178US11901299B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·25 claims
- 1276US10325860B2Microelectronic bond pads having integrated spring structuresINTEL CORP·Filed 2016·Granted Jun 18, 2019·2 cites·16 claims
- 1376US9368461B2Contact pads for integrated circuit packagesINTEL CORP·Filed 2014·Granted Jun 14, 2016·4 cites·23 claims
- 1476US7901982B2Modified chip attach processINTEL CORP·Filed 2009·Granted Mar 8, 2011·4 cites·6 claims
- 1576US7579213B2Modified chip attach processINTEL CORP·Filed 2007·Granted Aug 25, 2009·4 cites·12 claims
- 1674US12355492B2Spectrally interleaved optical transceiversLIGHTMATTER INC·Filed 2024·Granted Jul 8, 2025·0 cites·22 claims
- 1773US2025293780A1Spectrally interleaved optical transceiversLIGHTMATTER INC·Filed 2025·Application pending·0 cites
- 1872US9659899B2Die warpage control for thin die assemblyINTEL CORP·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 1968US8324737B2Modified chip attach processCHANDRAN BIJU·Filed 2011·Granted Dec 4, 2012·2 cites·6 claims
- 2066US7166540B2Method for reducing assembly-induced stress in a semiconductor dieINTEL CORP·Filed 2005·Granted Jan 23, 2007·3 cites·16 claims
- 2164US8941236B2Using collapse limiter structures between elements to reduce solder bump bridgingLIMAYE AMEYA·Filed 2012·Granted Jan 27, 2015·3 cites·16 claims
- 2262US6788859B1Laminate substrate containing fiber optic cablesIBM·Filed 2002·Granted Sep 7, 2004·7 cites·16 claims
- 2361US2025341688A1Pluggable fiber-to-chip coupling for wafer scale co-packaged opticsLIGHTMATTER INC·Filed 2025·Application pending·0 cites
- 2460US9394619B2Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed therebyINTEL CORP·Filed 2013·Granted Jul 19, 2016·0 cites·23 claims
- 2559US2024264395A1Optical fiber array with optical passthroughLIGHTMATTER INC·Filed 2024·Application pending·0 cites
- 2657US10811366B2Microelectronic bond pads having integrated spring structuresINTEL CORP·Filed 2019·Granted Oct 20, 2020·0 cites·27 claims
- 2754US9123732B2Die warpage control for thin die assemblySANE SANDEEP B·Filed 2012·Granted Sep 1, 2015·1 cites·16 claims
- 2852US12038858B2Processor package with universal optical input/outputINTEL CORP·Filed 2020·Granted Jul 16, 2024·0 cites·22 claims
- 2952US11824013B2Package substrate with reduced interconnect stressINTEL CORP·Filed 2019·Granted Nov 21, 2023·0 cites·20 claims
- 3050US11983135B2Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edgeINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·20 claims
- 3150US2023085944A1Core patch with matched pth to fli pitch for z-disaggregationINTEL CORP·Filed 2021·Application pending·0 cites
- 3249US2025321909A13d stacked i/o chiplet on optical interposer for high bandwidth applicationsLIGHTMATTER INC·Filed 2025·Application pending·0 cites
- 3345US11417592B2Methods of utilizing low temperature solder assisted mounting techniques for package structuresINTEL CORP·Filed 2016·Granted Aug 16, 2022·0 cites·15 claims
- 3444US10531575B2Systems and methods for replaceable bail grid array (BGA) packages on board substratesINTEL CORP·Filed 2016·Granted Jan 7, 2020·0 cites·20 claims
- 3544US2022092016A1Off-package high density, high bandwidth memory access using optical linksINTEL CORP·Filed 2020·Application pending·0 cites
- 3641US2008079129A1Shape memory based mechanical enabling mechanismGANAPATHYSUBRAMANIAN SHANKAR·Filed 2006·Application pending·0 cites
- 3740US11276625B2Methods of forming flexure based cooling solutions for package structuresINTEL CORP·Filed 2016·Granted Mar 15, 2022·0 cites·25 claims
- 3838US2006220195A1Structure and method to control underfillINTEL CORP·Filed 2005·Application pending·0 cites
- 3937US2019279960A1Integrated circuit packages with platesINTEL CORP·Filed 2016·Application pending·0 cites
- 4029US2006214313A1Die attach methods and apparatusPIEDA RUEL B·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →