Inventor · disambiguated record
Uwe Konietzka
Also filed as: KONIETZKA UWE
6 granted patents·6 pending applications·59 citations·filing 1993–2021
80Inventor score
Files withHERAEUS GMBH W C3MATERION ADVANCED MAT GERMANY GMBH2DEGUSSA1HERAEUS DEUTSCHLAND GMBH & CO KG1HERAEUS MATERIALS TECH GMBH1
Top patents by PatentIndex Score
12 records- 0170US6581669B2Sputtering target for depositing silicon layers in their nitride or oxide form and a process for its preparationHERAEUS GMBH W C·Filed 2001·Granted Jun 24, 2003·11 cites·5 claims
- 0260US5480532ASputter target for cathodic atomization to produce transparent, conductive layersLEYBOLD MATERIALS GMBH·Filed 1994·Granted Jan 2, 1996·21 cites·5 claims
- 0358US5407548AMethod for coating a substrate of low resistance to corrosionLEYBOLD AG·Filed 1993·Granted Apr 18, 1995·14 cites·11 claims
- 0455US11125708B2Silver alloy-based sputter targetMATERION ADVANCED MAT GERMANY GMBH·Filed 2016·Granted Sep 21, 2021·0 cites·16 claims
- 0555US5480531ATarget for cathode sputtering and method of its productionDEGUSSA·Filed 1993·Granted Jan 2, 1996·13 cites·4 claims
- 0654US2024018645A1CoZrTa(X) Sputtering Target with Improved Magnetic PropertiesMATERION ADVANCED MAT GERMANY GMBH·Filed 2021·Application pending·0 cites
- 0746US8974707B2Planar or tubular sputtering target and method for the production thereofHERAEUS MATERIALS TECH GMBH·Filed 2013·Granted Mar 10, 2015·0 cites·13 claims
- 0846US2005092455A1Processes for producing a sputtering target from a silicon-based alloy, a sputtering targetHERAEUS GMBH W C·Filed 2004·Application pending·0 cites
- 0944US2004094283A1Processes for producing a sputtering target from a silicon-based alloy, a sputtering targetHERAEUS GMBH W C·Filed 2003·Application pending·0 cites
- 1041US2006207740A1Processes for producing a sputtering target from a silicon-based alloy, a sputtering targetWEIGERT MARTIN·Filed 2006·Application pending·0 cites
- 1141US2017166999A1Silver-alloy based sputtering targetHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 1240US2003183508A1Sputtering target for depositing silicon layers in their nitride or oxide form and process for its preparationFiled 2003·Application pending·0 cites
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