Inventor · disambiguated record
Masami Yokozawa
Also filed as: YOKOZAWA MASAMI
10 granted patents·297 citations·filing 1982–1999
92Inventor score
Top patents by PatentIndex Score
10 records- 0192US4451973AMethod for manufacturing a plastic encapsulated semiconductor device and a lead frame thereforMATSUSHITA ELECTRONICS CORP·Filed 1982·Granted Jun 5, 1984·97 cites·2 claims
- 0271US4589010AMethod for manufacturing a plastic encapsulated semiconductor device and a lead frame thereforMATSUSHITA ELECTRONICS CORP·Filed 1984·Granted May 13, 1986·30 cites·10 claims
- 0370US5298793ASemiconductor device including an electrodeMATSUSHITA ELECTRONICS CORP·Filed 1992·Granted Mar 29, 1994·50 cites·7 claims
- 0462US6187114B1Solder material and electronic part using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Feb 13, 2001·33 cites·26 claims
- 0557US4482915ALead frame for plastic encapsulated semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1982·Granted Nov 13, 1984·20 cites·5 claims
- 0656US4503452APlastic encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1982·Granted Mar 5, 1985·21 cites·4 claims
- 0754US6215174B1Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frameMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Apr 10, 2001·18 cites·5 claims
- 0846US5629551ASemiconductor device comprising an over-temperature detection element for detecting excessive temperatures amplifiersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted May 13, 1997·11 cites·7 claims
- 0943US6335223B1Method for producing a resin-sealed semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Jan 1, 2002·10 cites·17 claims
- 1038US5461252ASemiconductor device comprising an over-temperature detection element for detecting excessive temperature of amplifiersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 24, 1995·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →