Inventor · disambiguated record
Michio Asahina
Also filed as: ASAHINA MICHIO
20 granted patents·1 pending application·445 citations·filing 1987–2004
96Inventor score
Files withSEIKO EPSON CORP21
Top patents by PatentIndex Score
21 records- 0187US6511910B2Method for manufacturing semiconductor devicesSEIKO EPSON CORP·Filed 2002·Granted Jan 28, 2003·34 cites·18 claims
- 0277US6326287B1Semiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 1999·Granted Dec 4, 2001·50 cites·25 claims
- 0377US6107182ASemiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 1998·Granted Aug 22, 2000·31 cites·5 claims
- 0476US6350685B1Method for manufacturing semiconductor devicesSEIKO EPSON CORP·Filed 1999·Granted Feb 26, 2002·48 cites·14 claims
- 0574US6723628B2Method for forming bonding pad structures in semiconductor devicesSEIKO EPSON CORP·Filed 2001·Granted Apr 20, 2004·18 cites·9 claims
- 0674US6614119B1Semiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 2000·Granted Sep 2, 2003·15 cites·11 claims
- 0772US6194304B1Semiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 1999·Granted Feb 27, 2001·36 cites·15 claims
- 0868US6429493B1Semiconductor device and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 1999·Granted Aug 6, 2002·29 cites·5 claims
- 0968US6144097ASemiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 1998·Granted Nov 7, 2000·33 cites·20 claims
- 1068US5342806AMethod for fabricating a semiconductor device having a conductor structure with a plated layerSEIKO EPSON CORP·Filed 1991·Granted Aug 30, 1994·40 cites·3 claims
- 1168US4826781ASemiconductor device and method of preparationSEIKO EPSON CORP·Filed 1987·Granted May 2, 1989·36 cites·35 claims
- 1255US7091609B2Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectricSEIKO EPSON CORP·Filed 2004·Granted Aug 15, 2006·5 cites·17 claims
- 1352US6137176ASemiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 1998·Granted Oct 24, 2000·15 cites·4 claims
- 1451US4985746ASemiconductor device and method of productionSEIKO EPSON CORP·Filed 1987·Granted Jan 15, 1991·13 cites·12 claims
- 1548US6812123B2Semiconductor devices and methods for manufacturing the sameSEIKO EPSON CORP·Filed 2001·Granted Nov 2, 2004·3 cites·13 claims
- 1646US5190886ASemiconductor device and method of productionSEIKO EPSON CORP·Filed 1992·Granted Mar 2, 1993·15 cites·2 claims
- 1740US5086006ASemiconductor device and method of productionSEIKO EPSON CORP·Filed 1991·Granted Feb 4, 1992·8 cites·2 claims
- 1839US2004048460A1Semiconductor device and method of fabricating the sameSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
- 1938US6458703B2Method for manufacturing semiconductor devices with allevration of thermal stress generation in conductive coatingSEIKO EPSON CORP·Filed 1999·Granted Oct 1, 2002·5 cites·22 claims
- 2037US5093276ASemiconductor device and method of productionSEIKO EPSON CORP·Filed 1991·Granted Mar 3, 1992·6 cites·2 claims
- 2135US6486555B2Semiconductor device having a contact structure using aluminumSEIKO EPSON CORP·Filed 1998·Granted Nov 26, 2002·5 cites·2 claims
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