Inventor · disambiguated record
Chien Ouyang
Also filed as: OUYANG CHIEN
29 granted patents·8 pending applications·496 citations·filing 2001–2022
97Inventor score
Files withSUN MICROSYSTEMS INC16OUYANG CHIEN14ORACLE AMERICA INC4PENDSE RAJENDRA D1STATS CHIPPAC PTE LTD1
Top patents by PatentIndex Score
37 records- 0198US7672129B1Intelligent microchannel coolingSUN MICROSYSTEMS INC·Filed 2006·Granted Mar 2, 2010·100 cites·16 claims
- 0298US7436059B1Thermoelectric cooling device arraysSUN MICROSYSTEMS INC·Filed 2006·Granted Oct 14, 2008·101 cites·20 claims
- 0394US9471063B2Robotic lawn mower with network sensorsOUYANG CHIEN·Filed 2012·Granted Oct 18, 2016·44 cites·12 claims
- 0493US7870893B2Multichannel cooling system with magnetohydrodynamic pumpORACLE AMERICA INC·Filed 2006·Granted Jan 18, 2011·30 cites·12 claims
- 0592US11048268B2Mapping and tracking system for robotsOUYANG CHIEN·Filed 2018·Granted Jun 29, 2021·9 cites·9 claims
- 0692US7245495B2Feedback controlled magneto-hydrodynamic heat sinkSUN MICROSYSTEMS INC·Filed 2005·Granted Jul 17, 2007·25 cites·17 claims
- 0790US7628198B2Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluidSUN MICROSYSTEMS INC·Filed 2006·Granted Dec 8, 2009·20 cites·20 claims
- 0889US7675163B2Carbon nanotubes for active direct and indirect cooling of electronics deviceSUN MICROSYSTEMS INC·Filed 2007·Granted Mar 9, 2010·17 cites·24 claims
- 0988US7886816B2Intelligent cooling method combining passive and active cooling componentsORACLE AMERICA INC·Filed 2006·Granted Feb 15, 2011·17 cites·8 claims
- 1087US10098277B2Robotic lawn mower with boundary standsOUYANG CHIEN·Filed 2016·Granted Oct 16, 2018·8 cites·4 claims
- 1186US8304919B2Integrated circuit system with stress redistribution layer and method of manufacture thereofPENDSE RAJENDRA D·Filed 2010·Granted Nov 6, 2012·9 cites·20 claims
- 1285US8522570B2Integrated circuit chip cooling using magnetohydrodynamics and recycled powerOUYANG CHIEN·Filed 2008·Granted Sep 3, 2013·13 cites·16 claims
- 1384US7839634B2Micro thrust coolingOUYANG CHIEN·Filed 2008·Granted Nov 23, 2010·12 cites·20 claims
- 1484US7621319B2Ferrofluid-cooled heat sinkSUN MICROSYSTEMS INC·Filed 2005·Granted Nov 24, 2009·12 cites·20 claims
- 1584US7295435B2Heat sink having ferrofluid-based pump for nanoliquid coolingSUN MICROSYSTEMS INC·Filed 2005·Granted Nov 13, 2007·12 cites·18 claims
- 1683US8336611B2Enhanced heat pipe cooling with MHD fluid flowOUYANG CHIEN·Filed 2009·Granted Dec 25, 2012·9 cites·8 claims
- 1783US7861769B2Magneto-hydrodynamic hot spot cooling heat sinkORACLE AMERICA INC·Filed 2005·Granted Jan 4, 2011·11 cites·11 claims
- 1880US7614445B2Enhanced heat pipe cooling with MHD fluid flowSUN MICROSYSTEMS INC·Filed 2006·Granted Nov 10, 2009·7 cites·8 claims
- 1980US7423874B2Magneto-hydrodynamic heat sinkSUN MICROSYSTEMS INC·Filed 2005·Granted Sep 9, 2008·10 cites·11 claims
- 2080US7310231B2Heat sink having magnet array for magneto-hydrodynamic hot spot coolingSUN MICROSYSTEMS INC·Filed 2005·Granted Dec 18, 2007·9 cites·20 claims
- 2177US8342234B2Plasma-driven cooling heat sinkOUYANG CHIEN·Filed 2008·Granted Jan 1, 2013·7 cites·6 claims
- 2274US7417858B2Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuitsSUN MICROSYSTEMS INC·Filed 2005·Granted Aug 26, 2008·6 cites·19 claims
- 2368US11755030B2Mapping and tracking system for robotsOUYANG CHIEN·Filed 2020·Granted Sep 12, 2023·0 cites·27 claims
- 2467US7362575B2Cooling method use diamond pins and heat pipesSUN MICROSYSTEMS INC·Filed 2006·Granted Apr 22, 2008·3 cites·10 claims
- 2562US7759790B2Lidless semiconductor coolingORACLE AMERICA INC·Filed 2007·Granted Jul 20, 2010·2 cites·9 claims
- 2662US7269007B2Magneto-hydrodynamic heat sinkSUN MICROSYSTEMS INC·Filed 2005·Granted Sep 11, 2007·2 cites·20 claims
- 2760US7562533B2Thermal-electric-MHD coolingSUN MICROSYSTEMS INC·Filed 2006·Granted Jul 21, 2009·1 cites·11 claims
- 2858US2008302514A1Plasma cooling heat sinkOUYANG CHIEN·Filed 2008·Application pending·0 cites
- 2953US12462084B2Power envelope analysis for the thermal optimization of multi-chip modulesSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 4, 2025·0 cites·25 claims
- 3047US2010194278A1Flow manipulation with micro plasmaOUYANG CHIEN·Filed 2009·Application pending·0 cites
- 3146US7516778B2Magneto-hydrodynamic heat sinkSUN MICROSYSTEMS INC·Filed 2005·Granted Apr 14, 2009·0 cites·22 claims
- 3246US2010032141A1cooling system utilizing carbon nanotubes for cooling of electrical systemsSUN MICROSYSTEMS INC·Filed 2008·Application pending·0 cites
- 3346US2010230087A1Cooling using micro-plasma excited on transmission lines structureOUYANG CHIEN·Filed 2008·Application pending·0 cites
- 3446US2009065177A1Cooling with microwave excited micro-plasma and ionsOUYANG CHIEN·Filed 2008·Application pending·0 cites
- 3544US2008229759A1Method and apparatus for cooling integrated circuit chips using recycled powerOUYANG CHIEN·Filed 2007·Application pending·0 cites
- 3643US2012290165A1Flexible Robotic MowerOUYANG CHIEN·Filed 2012·Application pending·0 cites
- 3736US2003029481A1UmbrellaFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →