Inventor · disambiguated record

Jeng-Shien Hsieh

Also filed as: HSIEH JENG-SHIEN

35 granted patents·16 pending applications·344 citations·filing 2012–2025

97Inventor score

Technology areasH10W H10P G02B H01L G02F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD47 TAIWAN SEMICONDUCTOR MFG3 TAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD1

Top patents by PatentIndex Score

51 records

0199US10162139B1Semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·96 cites·20 claims
0299US9831148B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·104 cites·20 claims
0398US10153239B2Antennas and waveguides in InFO structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·59 cites·20 claims
0496US10163852B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·13 cites·20 claims
0594US12125798B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·20 claims
0693US10481351B2Semicondcutor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
0793US9735118B2Antennas and waveguides in InFO structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
0893US9252491B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 2, 2016·11 cites·20 claims
0992US10497668B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·5 cites·20 claims
1091US11482788B2Antenna device and method for manufacturing antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·20 claims
1191US10763164B2Package structure with inductor and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·7 cites·20 claims
1290US12417991B2Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·1 cites·20 claims
1390US10996410B2Methods of forming semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·4 cites·20 claims
1490US9893042B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·7 cites·25 claims
1589US10770795B2Antenna device and method for manufacturing antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 8, 2020·5 cites·20 claims
1685US10665560B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·3 cites·18 claims
1784US10270172B2Embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
1883US11063016B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·2 cites·20 claims
1982US11050153B2Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
2082US2024332807A1Antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2181US2025357457A1Three dimensional (3d) chiplet and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2280US2024321757A1Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2379US12057407B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
2479US2024355755A1Semiconductor Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2578US12040566B2Antenna deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
2677US2025355171A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2776US11094634B2Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 17, 2021·1 cites·20 claims
2875US11830841B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
2974US12040281B2Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
3074US11984668B2Method of embedding low-k materials in antennasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
3174US2025323198A1Chip stack structure with conductive plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3273US2025329701A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD·Filed 2025·Application pending·0 cites
3371US2025239579A1Semiconductor package structure with interposer diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3471US2025244527A1Integrated Memory Device with Optical LinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3568US11562926B2Package structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
3668US11322470B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
3766US2023420437A1Three dimensional (3d) chiplet and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3862US10978781B23D antenna for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
3957US2025239578A1Optical connector unit for a photonic assembly and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4055US10498009B23D antenna for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·0 cites·20 claims
4155US9331018B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 3, 2016·0 cites·20 claims
4254US2024404900A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4353US9355956B2Inductor for semiconductor integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·0 cites·20 claims
4453US2024047365A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4553US2024079392A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4653US2024206193A1Structure and formation method of package with integrated chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4752US2025237810A1Tunable photonic couplers for electronic/photonic systems and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4851US10090243B2Inductor for semiconductor integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·0 cites·20 claims
4951US9773730B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·0 cites·20 claims
5045US9391350B2RF choke device for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 12, 2016·0 cites·20 claims

Showing the top 50 of 51 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →