Inventor · disambiguated record
Gary B. Larson
Also filed as: LARSON GARY · LARSON GARY B · LARSON GARY R
24 granted patents·2 pending applications·1,002 citations·filing 1986–2007
97Inventor score
Top patents by PatentIndex Score
26 records- 0196US5235139AMethod for fabricating printed circuitsMACDERMID INCORPRATED·Filed 1990·Granted Aug 10, 1993·365 cites·12 claims
- 0291US5160579AProcess for manufacturing printed circuit employing selective provision of solderable coatingMACDERMID INC·Filed 1991·Granted Nov 3, 1992·86 cites·9 claims
- 0388US6281090B1Method for the manufacture of printed circuit boards with plated resistorsMACDERMID INC·Filed 2000·Granted Aug 28, 2001·69 cites·28 claims
- 0486US5747098AProcess for the manufacture of printed circuit boardsMACDERMID INC·Filed 1996·Granted May 5, 1998·61 cites·11 claims
- 0586US4804615AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1986·Granted Feb 14, 1989·60 cites·12 claims
- 0683US5288377AProcess for the manufacture of printed circuits using electrophoretically deposited organic resistsMACDERMID INC·Filed 1993·Granted Feb 22, 1994·35 cites·11 claims
- 0779US7887693B2Acid copper electroplating bath compositionNIKOLOVA MARIA·Filed 2007·Granted Feb 15, 2011·4 cites·17 claims
- 0879US4748104ASelective metallization process and additive method for manufactured printed circuit boardsMACDERMID INC·Filed 1986·Granted May 31, 1988·26 cites·18 claims
- 0973US4831210AShields for electromagnetic radiationMACDERMID INC·Filed 1987·Granted May 16, 1989·29 cites·12 claims
- 1072US4897118ASelective metallization process, additive method for manufacturing printed circuit boards, and composition for use thereinMACDERMID INC·Filed 1987·Granted Jan 30, 1990·18 cites·2 claims
- 1169US5289630AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1991·Granted Mar 1, 1994·35 cites·4 claims
- 1268US5362334AComposition and process for treatment of metallic surfacesMACDERMID INC·Filed 1993·Granted Nov 8, 1994·33 cites·12 claims
- 1368US5261154AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1992·Granted Nov 16, 1993·34 cites·10 claims
- 1465US6044550AProcess for the manufacture of printed circuit boardsMACDERMID INC·Filed 1996·Granted Apr 4, 2000·23 cites·12 claims
- 1560US5474798AMethod for the manufacture of printed circuit boardsMACDERMID INC·Filed 1994·Granted Dec 12, 1995·24 cites·13 claims
- 1659US5550006APhosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resistsMACDERMID INC·Filed 1994·Granted Aug 27, 1996·20 cites·7 claims
- 1757US4761303AProcess for preparing multilayer printed circuit boardsMACDERMID INC·Filed 1986·Granted Aug 2, 1988·20 cites·28 claims
- 1853US5843517AComposition and method for selective platingMACDERMID INC·Filed 1997·Granted Dec 1, 1998·16 cites·13 claims
- 1953US4806200AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1987·Granted Feb 21, 1989·16 cites·6 claims
- 2042US4732649AMethod for manufacture of printed circuit boardsMACDERMID INC·Filed 1986·Granted Mar 22, 1988·10 cites·9 claims
- 2140US5290608AMethod for forming a patterned maskMACDERMID INC·Filed 1993·Granted Mar 1, 1994·9 cites·15 claims
- 2239US6023842AProcess for the manufacture of printed circuit boardsMACDERMID INC·Filed 1996·Granted Feb 15, 2000·6 cites·13 claims
- 2338US2002020491A1High speed flip chip assembly processFiled 2001·Application pending·0 cites
- 2437US2004026033A1High speed flip chip assembly processFiled 2003·Application pending·0 cites
- 2536US7666471B2Polyimide substrate and method of manufacturing printed wiring board using the sameWOJTASZEK MARK·Filed 2006·Granted Feb 23, 2010·0 cites·4 claims
- 2628US6403146B1Process for the manufacture of printed circuit boardsFiled 1997·Granted Jun 11, 2002·3 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Gary B. Larson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →