Inventor · disambiguated record
Frank S. Geefay
Also filed as: GEEFAY FRANK S · GEEFAY FRANK SIGMING
18 granted patents·5 pending applications·1,407 citations·filing 1999–2008
96Inventor score
Files withAGILENT TECHNOLOGIES INC14GEEFAY FRANK S4AVAGO TECHNOLOGIES WIRELESS IP2AVAGO TECHNOLOGIES FIBER IP PT1RUBY RICHARD C1
Top patents by PatentIndex Score
23 records- 0198US6777263B1Film deposition to enhance sealing yield of microcap wafer-level package with viasAGILENT TECHNOLOGIES INC·Filed 2003·Granted Aug 17, 2004·241 cites·8 claims
- 0296US6429511B2Microcap wafer-level packageAGILENT TECHNOLOGIES INC·Filed 2001·Granted Aug 6, 2002·203 cites·10 claims
- 0395US6228675B1Microcap wafer-level package with viasAGILENT TECHNOLOGIES INC·Filed 1999·Granted May 8, 2001·252 cites·20 claims
- 0494US6376280B1Microcap wafer-level packageAGILENT TECHNOLOGIES INC·Filed 1999·Granted Apr 23, 2002·176 cites·20 claims
- 0594US6265246B1Microcap wafer-level packageAGILENT TECHNOLOGIES INC·Filed 1999·Granted Jul 24, 2001·181 cites·16 claims
- 0693US6903012B2Sloped via contactsAGILENT TECHNOLOGIES INC·Filed 2004·Granted Jun 7, 2005·81 cites·15 claims
- 0792US7161283B1Method for placing metal contacts underneath FBAR resonatorsAVAGO TECHNOLOGIES WIRELESS IP·Filed 2005·Granted Jan 9, 2007·27 cites·20 claims
- 0890US6787897B2Wafer-level package with silicon gasketAGILENT TECHNOLOGIES INC·Filed 2001·Granted Sep 7, 2004·65 cites·13 claims
- 0988US6953990B2Wafer-level packaging of optoelectronic devicesAGILENT TECHNOLOGIES INC·Filed 2003·Granted Oct 11, 2005·26 cites·17 claims
- 1087US6777267B2Die singulation using deep silicon etchingAGILENT TECHNOLOGIES INC·Filed 2002·Granted Aug 17, 2004·41 cites·19 claims
- 1185US7554177B2Attachment system incorporating a recess in a structureAVAGO TECHNOLOGIES WIRELESS IP·Filed 2005·Granted Jun 30, 2009·15 cites·14 claims
- 1283US6979597B2Wafer-level package with silicon gasketAGILENT TECHNOLOGIES INC·Filed 2003·Granted Dec 27, 2005·32 cites·12 claims
- 1380US6919222B2Method for sealing a semiconductor device and apparatus embodying the methodAGILENT TECHNOLOGIES INC·Filed 2002·Granted Jul 19, 2005·24 cites·5 claims
- 1475US6763702B2Method and apparatus for hermeticity determination and leak detection in semiconductor packagingAGILENT TECHNOLOGIES INC·Filed 2002·Granted Jul 20, 2004·17 cites·16 claims
- 1574US8102044B2Bonded wafer structure and method of fabricationRUBY RICHARD C·Filed 2008·Granted Jan 24, 2012·4 cites·15 claims
- 1669US6555440B1Process for fabricating a top side pitted diode deviceAGILENT TECHNOLOGIES INC·Filed 2000·Granted Apr 29, 2003·16 cites·18 claims
- 1766US7422929B2Wafer-level packaging of optoelectronic devicesAVAGO TECHNOLOGIES FIBER IP PT·Filed 2005·Granted Sep 9, 2008·2 cites·20 claims
- 1853US6836013B2Method for sealing a semiconductor device and apparatus embodying the methodAGILENT TECHNOLOGIES INC·Filed 2003·Granted Dec 28, 2004·4 cites·2 claims
- 1951US2007020807A1Protective structures and methods of fabricating protective structures over wafersGEEFAY FRANK S·Filed 2006·Application pending·0 cites
- 2044US2008283944A1PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTUREGEEFAY FRANK S·Filed 2007·Application pending·0 cites
- 2144US2006099733A1Semiconductor package and fabrication methodGEEFAY FRANK S·Filed 2004·Application pending·0 cites
- 2241US2007004079A1Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chipsGEEFAY FRANK S·Filed 2005·Application pending·0 cites
- 2338US2003119308A1Sloped via contactsFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Frank S. Geefay files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →