Inventor · disambiguated record
Wen-Ta Tsai
Also filed as: TSAI WEN-TA
23 granted patents·1 pending application·613 citations·filing 1994–2022
97Inventor score
Files withZHEJIANG HIMAX FURNITURE INDUS11SILICONWARE PRECISION INDUSTRIES CO LTD5NAT SCIENCE COUNCIL3SILICONWARE PREC IND LTD1TUNG MUNG DEV CO LTD1
Top patents by PatentIndex Score
24 records- 0198USD514832SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2003·Granted Feb 14, 2006·112 cites·1 claims
- 0293USD516828SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2004·Granted Mar 14, 2006·52 cites·1 claims
- 0392US6608388B2Delamination-preventing substrate and semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Aug 19, 2003·87 cites·15 claims
- 0487US6307257B1Dual-chip integrated circuit package with a chip-die pad formed from leadframe leadsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Oct 23, 2001·96 cites·15 claims
- 0584USD512574SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2004·Granted Dec 13, 2005·28 cites·1 claims
- 0682USD514831SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2003·Granted Feb 14, 2006·26 cites·1 claims
- 0782USD476495SChairFiled 2002·Granted Jul 1, 2003·27 cites·1 claims
- 0881USD554877SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2005·Granted Nov 13, 2007·26 cites·1 claims
- 0976USD569116SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2005·Granted May 20, 2008·22 cites·1 claims
- 1068USD468140SChair armrestFiled 2002·Granted Jan 7, 2003·15 cites·1 claims
- 1165USD470322SChairFiled 2002·Granted Feb 18, 2003·13 cites·1 claims
- 1260US6590279B1Dual-chip integrated circuit package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jul 8, 2003·26 cites·10 claims
- 1360US6428849B1Method for the co-deposition of silicon and nitrogen on stainless steel surfaceNAT SCIENCE COUNCIL·Filed 2000·Granted Aug 6, 2002·4 cites·14 claims
- 1460US5411770AMethod of surface modification of stainless steelNAT SCIENCE COUNCIL·Filed 1994·Granted May 2, 1995·22 cites·28 claims
- 1557US6777266B2Dual-chip integrated circuit package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Aug 17, 2004·7 cites·6 claims
- 1655USD500607SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2003·Granted Jan 11, 2005·8 cites·1 claims
- 1752US2024093373A1Method for preparing antibacterial stainless steel by surface alloyingTUNG MUNG DEV CO LTD·Filed 2022·Application pending·0 cites
- 1851USD475210SChairZHEJIANG HIMAX FURNITURE INDUS·Filed 2002·Granted Jun 3, 2003·7 cites·1 claims
- 1947US6264535B1Wafer sawing/grinding processSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jul 24, 2001·13 cites·11 claims
- 2045USD537282SArmrestZHEJIANG HIMAX FURNITURE INDUS·Filed 2005·Granted Feb 27, 2007·5 cites·1 claims
- 2142USD537283SArmrestZHEJIANG HIMAX FURNITURE INDUS·Filed 2005·Granted Feb 27, 2007·4 cites·1 claims
- 2239USD538075SArmrestZHEJIANG HIMAX FURNITURE INDUS·Filed 2005·Granted Mar 13, 2007·3 cites·1 claims
- 2337US6903441B2Semiconductor package with enhanced chip groundability and method of fabricating the sameSILICONWARE PREC IND LTD·Filed 2003·Granted Jun 7, 2005·4 cites·19 claims
- 2431US5496593AProcess for producing a nitrogen-alloyed stainless steel layer on steelNAT SCIENCE COUNCIL·Filed 1994·Granted Mar 5, 1996·6 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →