Inventor · disambiguated record
Tasao Soga
Also filed as: SOGA TASAO
34 granted patents·6 pending applications·1,388 citations·filing 1981–2013
98Inventor score
Top patents by PatentIndex Score
40 records- 0195US7547966B2Power semiconductor moduleHITACHI LTD·Filed 2007·Granted Jun 16, 2009·47 cites·21 claims
- 0294US6563225B2Product using Zn-Al alloy solderHITACHI LTD·Filed 2002·Granted May 13, 2003·110 cites·17 claims
- 0394US4825284ASemiconductor resin package structureHITACHI LTD·Filed 1986·Granted Apr 25, 1989·179 cites·20 claims
- 0491US7671465B2Power semiconductor moduleHITACHI LTD·Filed 2007·Granted Mar 2, 2010·24 cites·16 claims
- 0591US5867809AElectric appliance, printed circuit board, remained life estimation method, and system thereofHITACHI LTD·Filed 1995·Granted Feb 2, 1999·142 cites·17 claims
- 0690US6872465B2SolderHITACHI LTD·Filed 2003·Granted Mar 29, 2005·45 cites·26 claims
- 0788US8022551B2Solder composition for electronic devicesRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 20, 2011·13 cites·11 claims
- 0888US7145236B2Semiconductor device having solder bumps reliably reflow solderableRENESAS TECH CORP·Filed 2002·Granted Dec 5, 2006·47 cites·7 claims
- 0988US4562637AMethod of manufacturing solar batteryHITACHI LTD·Filed 1984·Granted Jan 7, 1986·70 cites·11 claims
- 1087US6486411B2Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrateHITACHI LTD·Filed 2001·Granted Nov 26, 2002·43 cites·26 claims
- 1187US4970575ASemiconductor deviceHITACHI LTD·Filed 1990·Granted Nov 13, 1990·98 cites·11 claims
- 1287US4906823ASolder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing sameHITACHI LTD·Filed 1988·Granted Mar 6, 1990·72 cites·2 claims
- 1387US4649990AHeat-conducting cooling moduleHITACHI LTD·Filed 1985·Granted Mar 17, 1987·75 cites·12 claims
- 1486US8004075B2Semiconductor power module including epoxy resin coatingHITACHI LTD·Filed 2007·Granted Aug 23, 2011·13 cites·12 claims
- 1586US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 1685US4970577ASemiconductor chip moduleHITACHI LTD·Filed 1989·Granted Nov 13, 1990·71 cites·16 claims
- 1783US4821142ACeramic multilayer circuit board and semiconductor moduleHITACHI LTD·Filed 1987·Granted Apr 11, 1989·55 cites·9 claims
- 1878US8503189B2Pb-free solder-connected structure and electronic deviceSHIMOKAWA HANAE·Filed 2010·Granted Aug 6, 2013·3 cites·11 claims
- 1977US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 2076US7075183B2Electronic deviceHITACHI LTD·Filed 2001·Granted Jul 11, 2006·18 cites·9 claims
- 2175US5942185ALead-free solder used for connecting electronic parts on organic substrate and electronic products made using sameHITACHI LTD·Filed 1997·Granted Aug 24, 1999·37 cites·13 claims
- 2273US8125090B2Semiconductor power moduleSOGA TASAO·Filed 2010·Granted Feb 28, 2012·4 cites·13 claims
- 2372US7013564B2Method of producing an electronic device having a PB free solder connectionHITACHI LTD·Filed 2001·Granted Mar 21, 2006·10 cites·19 claims
- 2472US6204490B1Method and apparatus of manufacturing an electronic circuit boardHITACHI LTD·Filed 1999·Granted Mar 20, 2001·33 cites·21 claims
- 2570US7722962B2Solder foil, semiconductor device and electronic deviceRENESAS TECH CORP·Filed 2001·Granted May 25, 2010·18 cites·5 claims
- 2670US7709746B2Pb-free solder-connected structure and electronic deviceRENESAS TECH CORP·Filed 2006·Granted May 4, 2010·3 cites·13 claims
- 2769US7259465B2Semiconductor device with lead-free solderHITACHI LTD·Filed 2002·Granted Aug 21, 2007·12 cites·20 claims
- 2867US6960396B2Pb-free solder-connected structure and electronic deviceHITACHI LTD·Filed 2002·Granted Nov 1, 2005·7 cites·27 claims
- 2965US4908695ACooling apparatus and semiconductor device employing the sameHITACHI LTD·Filed 1988·Granted Mar 13, 1990·31 cites·10 claims
- 3060US8907475B2Pb-free solder-connected structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·0 cites·12 claims
- 3149US2006145352A1Electronic deviceHITACHI LTD·Filed 2006·Application pending·0 cites
- 3248USRE34887ECeramic multilayer circuit board and semiconductor moduleHITACHI LTD·Filed 1991·Granted Mar 28, 1995·15 cites·6 claims
- 3348US4491562AThermal fatigue resistant low-melting point solder alloysHITACHI LTD·Filed 1983·Granted Jan 1, 1985·8 cites·2 claims
- 3446US2009116197A1Method for power semiconductor module fabrication, its apparatus, power semiconductor module and its junction methodFUNAKOSHI SUNAO·Filed 2008·Application pending·0 cites
- 3544US4516149ASemiconductor device having ribbon electrode structure and method for fabricating the sameHITACHI LTD·Filed 1981·Granted May 7, 1985·11 cites·1 claims
- 3641US2004007384A1Electronic deviceHITACHI LTD·Filed 2003·Application pending·0 cites
- 3740US4503597AMethod of forming a number of solder layers on a semiconductor waferHITACHI LTD·Filed 1983·Granted Mar 12, 1985·10 cites·26 claims
- 3835US2003184986A1Circuit board and electronic device, and method of manufacturing sameHITACHI LTD·Filed 2003·Application pending·0 cites
- 3935US2002009610A1Technical fieldFiled 2001·Application pending·0 cites
- 4034US2004177997A1Electronic apparatusFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →