Inventor · disambiguated record
William T. Chou
Also filed as: CHOU WILLIAM · CHOU WILLIAM T · CHOU WILLIAM TAI-HUA
45 granted patents·1 pending application·3,924 citations·filing 1990–2017
99Inventor score
Top patents by PatentIndex Score
46 records- 0198US6690845B1Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 2000·Granted Feb 10, 2004·334 cites·19 claims
- 0298US6343171B1Systems based on opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 29, 2002·429 cites·26 claims
- 0398US6239485B1Reduced cross-talk noise high density signal interposer with power and ground wrapFUJITSU LTD·Filed 1999·Granted May 29, 2001·194 cites·6 claims
- 0498US6187652B1Method of fabrication of multiple-layer high density substrateFUJITSU LTD·Filed 1998·Granted Feb 13, 2001·177 cites·18 claims
- 0598US5334804AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1992·Granted Aug 2, 1994·280 cites·25 claims
- 0697US6845184B1Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 18, 2005·286 cites·25 claims
- 0797US6039889AProcess flows for formation of fine structure layer pairs on flexible filmsFUJITSU LTD·Filed 1999·Granted Mar 21, 2000·156 cites·20 claims
- 0896US6611635B1Opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Aug 26, 2003·193 cites·45 claims
- 0996US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 1095US5773889AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1996·Granted Jun 30, 1998·162 cites·20 claims
- 1194US6733685B2Methods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 2001·Granted May 11, 2004·64 cites·14 claims
- 1294US5419038AMethod for fabricating thin-film interconnectorFUJITSU LTD·Filed 1993·Granted May 30, 1995·96 cites·33 claims
- 1393US5660957AElectron-beam treatment procedure for patterned mask layersFUJITSU LTD·Filed 1996·Granted Aug 26, 1997·135 cites·10 claims
- 1493US5098625AProcess for forming an expanded porous tetrafluoroethylene polymerYEU MING TAI CHEMICAL IND CO L·Filed 1990·Granted Mar 24, 1992·107 cites·19 claims
- 1591US6852223B2Asymmetric porous polytetrafluoroethylene membrane and process for preparing the sameYEU MING TAI CHEMICAL IND CO L·Filed 2002·Granted Feb 8, 2005·47 cites·10 claims
- 1690US6662443B2Method of fabricating a substrate with a via connectionFUJITSU LTD·Filed 2001·Granted Dec 16, 2003·47 cites·46 claims
- 1789US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 1889US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 1989US5536362AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1994·Granted Jul 16, 1996·85 cites·25 claims
- 2086US6081026AHigh density signal interposer with power and ground wrapFUJITSU LTD·Filed 1998·Granted Jun 27, 2000·61 cites·6 claims
- 2185US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 2280US5455064AProcess for fabricating a substrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·57 cites·4 claims
- 2378US5656414AMethods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the likeFUJITSU LTD·Filed 1993·Granted Aug 12, 1997·32 cites·20 claims
- 2477US5891354AMethods of etching through wafers and substrates with a composite etch stop layerFUJITSU LTD·Filed 1996·Granted Apr 6, 1999·50 cites·20 claims
- 2576US7374679B2Asymmetric porous polytetrafluoroethylene membrane for a filterYEU MING TAI CHEMICAL IND CO L·Filed 2004·Granted May 20, 2008·24 cites·5 claims
- 2675US6702971B2Production method of a polytetrafluoroethylene sheet or filmYEU MING TAI CHEMICAL IND CO L·Filed 2001·Granted Mar 9, 2004·13 cites·11 claims
- 2774US6197664B1Method for electroplating vias or through holes in substrates having conductors on both sidesFUJITSU LTD·Filed 1999·Granted Mar 6, 2001·35 cites·9 claims
- 2874US5916453AMethods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 1996·Granted Jun 29, 1999·38 cites·22 claims
- 2973US6080472APorous polytetrafluoroethylene molded articleYEU MING TAI CHEMICAL IND CO L·Filed 1998·Granted Jun 27, 2000·37 cites·21 claims
- 3071US5789140AMethod of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residueFUJITSU LTD·Filed 1996·Granted Aug 4, 1998·25 cites·10 claims
- 3171US5382827AFunctional substrates for packaging semiconductor chipsFUJITSU LTD·Filed 1992·Granted Jan 17, 1995·44 cites·9 claims
- 3270US5323520AProcess for fabricating a substrate with thin film capacitorFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·35 cites·26 claims
- 3368US5475262AFunctional substrates for packaging semiconductor chipsFUJITSU LTD·Filed 1993·Granted Dec 12, 1995·39 cites·13 claims
- 3463US5652693ASubstrate with thin film capacitor and insulating plugFUJITSU LTD·Filed 1995·Granted Jul 29, 1997·25 cites·8 claims
- 3561US7309663B2Asymmetric porous polytetrafluoroethylene membrane for clothingYEU MING TAI CHEMICAL IND CO L·Filed 2004·Granted Dec 18, 2007·2 cites·5 claims
- 3660US6226171B1Power conducting substrates with high-yield integrated substrate capacitorFUJITSU LTD·Filed 1999·Granted May 1, 2001·24 cites·22 claims
- 3760US5746903AWet chemical processing techniques for plating high aspect ratio featuresFUJITSU LTD·Filed 1996·Granted May 5, 1998·14 cites·10 claims
- 3857US5376586AMethod of curing thin films of organic dielectric materialFUJITSU LTD·Filed 1993·Granted Dec 27, 1994·23 cites·9 claims
- 3955US2007090252A1Safety clothes hook having alterable anchor directionSHAMAH IND CO LTD·Filed 2005·Application pending·0 cites
- 4053US5406446AThin film capacitorFUJITSU LTD·Filed 1994·Granted Apr 11, 1995·17 cites·7 claims
- 4151US5942373APattern or via structure formed through supplemental electron beam exposure and development to remove image residueFUJITSU LTD·Filed 1998·Granted Aug 24, 1999·13 cites·20 claims
- 4248US5930890AStructure and fabrication procedure for a stable postFUJITSU LTD·Filed 1997·Granted Aug 3, 1999·12 cites·10 claims
- 4344US5778529AMethod of making a multichip module substrateFUJITSU LTD·Filed 1996·Granted Jul 14, 1998·10 cites·24 claims
- 4443US10956498B2Scanning for bindings in webpage markupGOOGLE LLC·Filed 2017·Granted Mar 23, 2021·0 cites·19 claims
- 4534US6221567B1Method of patterning polyamic acid layersFUJITSU LTD·Filed 1999·Granted Apr 24, 2001·4 cites·34 claims
- 4633US5458731AMethod for fast and non-destructive examination of etched featuresFUJITSU LTD·Filed 1994·Granted Oct 17, 1995·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →