Inventor · disambiguated record
William J. Casey
Also filed as: CASEY III WILLIAM J · CASEY WILLIAM J
27 granted patents·1 pending application·2,792 citations·filing 1975–2016
98Inventor score
Top patents by PatentIndex Score
28 records- 0196US7647932B2Smoking articleREYNOLDS TOBACCO CO R·Filed 2005·Granted Jan 19, 2010·267 cites·20 claims
- 0296US5099861AAerosol delivery articleREYNOLDS TOBACCO CO R·Filed 1990·Granted Mar 31, 1992·456 cites·98 claims
- 0396US5065776ACigarette with tobacco/glass fuel wrapperREYNOLDS TOBACCO CO R·Filed 1990·Granted Nov 19, 1991·332 cites·20 claims
- 0495US5396911ASubstrate material for smoking articlesREYNOLDS TOBACCO CO R·Filed 1991·Granted Mar 14, 1995·384 cites·72 claims
- 0595US5019122ASmoking article with an enclosed heat conductive capsule containing an aerosol forming substanceREYNOLDS TOBACCO CO R·Filed 1987·Granted May 28, 1991·439 cites·15 claims
- 0692US5027837ACigaretteREYNOLDS TOBACCO CO R·Filed 1990·Granted Jul 2, 1991·210 cites·94 claims
- 0787US5415186ASubstrates material for smoking articlesREYNOLDS TOBACCO CO R·Filed 1993·Granted May 16, 1995·133 cites·55 claims
- 0887US5156170ACigaretteREYNOLDS TOBACCO CO R·Filed 1991·Granted Oct 20, 1992·122 cites·67 claims
- 0987US5133368AImpact modifying agent for use with smoking articlesREYNOLDS TOBACCO CO R·Filed 1987·Granted Jul 28, 1992·126 cites·15 claims
- 1079US7119563B2Integrated circuit characterization printed circuit boardMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 10, 2006·7 cites·7 claims
- 1176US6974330B2Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating sameMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 13, 2005·21 cites·56 claims
- 1275US4068671ANicotine removal processAMF INC·Filed 1975·Granted Jan 17, 1978·31 cites·9 claims
- 1373US7213330B2Method of fabricating an electronic deviceMICRON TECHNOLOGY INC·Filed 2004·Granted May 8, 2007·17 cites·16 claims
- 1473US6231047B1Brush sealEG & G ENGINEERED PRODUCTS·Filed 1998·Granted May 15, 2001·38 cites·24 claims
- 1570US6813600B1Preclassification of audio material in digital audio compression applicationsLUCENT TECHNOLOGIES INC·Filed 2000·Granted Nov 2, 2004·23 cites·28 claims
- 1667US6924637B2Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit deviceMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 2, 2005·10 cites·10 claims
- 1762US6092714AMethod of utilizing a plasma gas mixture containing argon and CF4 to clean and coat a conductorMCMS INC·Filed 1999·Granted Jul 25, 2000·21 cites·1 claims
- 1860USD320083SCombined eyedrop dispenser and coverACORN LABORATORIES INC·Filed 1989·Granted Sep 17, 1991·10 cites·1 claims
- 1959US5371782AMethod and apparatus for selecting a preferred service provider during a call setup in a public cordless telephone systemAT & T CORP·Filed 1991·Granted Dec 6, 1994·58 cites·17 claims
- 2057US9248240B2Formulation delivery deviceCASEY WILLIAM J·Filed 2009·Granted Feb 2, 2016·1 cites·17 claims
- 2157US5396910ACigarette filterREYNOLDS TOBACCO CO R·Filed 1993·Granted Mar 14, 1995·26 cites·14 claims
- 2243US4134107AReplacement elevator call button assemblyMILLER GEORGE E·Filed 1977·Granted Jan 9, 1979·8 cites·4 claims
- 2342US6229218B1Interconnect device and method for mating dissimilar electronic package footprintsMCMS INC·Filed 1998·Granted May 8, 2001·13 cites·2 claims
- 2442US2016257470A1Applicator packageCASEY WILLIAM J·Filed 2016·Application pending·0 cites
- 2541US4078484AAutomatic actuator for normally manually operable selector elementsROCKAWAY CORP·Filed 1976·Granted Mar 14, 1978·6 cites·31 claims
- 2640US7271581B2Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 18, 2007·0 cites·23 claims
- 2738US4909801AEyedrop dispenser having a bumperACORN LAB INC·Filed 1988·Granted Mar 20, 1990·29 cites·9 claims
- 2834US6229210B1Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volumeMCMS INC·Filed 1998·Granted May 8, 2001·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →