Inventor · disambiguated record
Jialing Yang
Also filed as: YANG JIALING
7 granted patents·4 pending applications·249 citations·filing 2000–2025
86Inventor score
Top patents by PatentIndex Score
11 records- 0198US9870899B2Cobalt etch backLAM RES CORP·Filed 2015·Granted Jan 16, 2018·32 cites·19 claims
- 0296US6441959B1Method and system for testing a tunable chromatic dispersion, dispersion slope, and polarization mode dispersion compensator utilizing a virtually imaged phased arrayAVANEX CORP·Filed 2000·Granted Aug 27, 2002·149 cites·1 claims
- 0394US10784086B2Cobalt etch backLAM RES CORP·Filed 2017·Granted Sep 22, 2020·9 cites·14 claims
- 0485US6392807B1Tunable chromatic dispersion compensator utilizing a virtually imaged phased array and folded light pathsAVANEX CORP·Filed 2000·Granted May 21, 2002·33 cites·22 claims
- 0584US6621625B1Optical node including three-stage optical amplifier with automatic gain and level controlAVANEX CORP·Filed 2000·Granted Sep 16, 2003·26 cites·8 claims
- 0671US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 0764US2025191926A1Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layersLAM RES CORP·Filed 2025·Application pending·0 cites
- 0860US12249514B2Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layersLAM RES CORP·Filed 2020·Granted Mar 11, 2025·0 cites·16 claims
- 0959US2025068065A1Enhanced euv underlayer effect with diffusion barrier layerLAM RES CORP·Filed 2023·Application pending·0 cites
- 1054US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 1147US2023323532A1Rib cover for multi-station processing modulesLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →