Inventor · disambiguated record
Hui-Jung Wu
Also filed as: WU HUI-JUNG
44 granted patents·11 pending applications·2,129 citations·filing 1997–2024
99Inventor score
Top patents by PatentIndex Score
55 records- 0198US12094711B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Sep 17, 2024·5 cites·18 claims
- 0298US5874069ACosmetic composition containing silicon-modified amides as thickening agents and method of forming sameCOLGATE PALMOLIVE CO·Filed 1997·Granted Feb 23, 1999·460 cites·49 claims
- 0397US10546748B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2018·Granted Jan 28, 2020·25 cites·20 claims
- 0497US7576006B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 18, 2009·55 cites·19 claims
- 0597US5919441ACosmetic composition containing thickening agent of siloxane polymer with hydrogen-bonding groupsCOLGATE PALMOLIVE CO·Filed 1997·Granted Jul 6, 1999·501 cites·81 claims
- 0696US12183589B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2021·Granted Dec 31, 2024·3 cites·20 claims
- 0796US11322351B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2019·Granted May 3, 2022·15 cites·32 claims
- 0896US6368400B1Absorbing compounds for spin-on-glass anti-reflective coatings for photolithographyHONEYWELL INT·Filed 2000·Granted Apr 9, 2002·69 cites·18 claims
- 0995US11355353B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2019·Granted Jun 7, 2022·15 cites·15 claims
- 1095US6495479B1Simplified method to produce nanoporous silicon-based filmsHONEYWELL INT INC·Filed 2000·Granted Dec 17, 2002·92 cites·36 claims
- 1194US8021486B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Sep 20, 2011·14 cites·18 claims
- 1293US8173537B1Methods for reducing UV and dielectric diffusion barrier interactionCHATTOPADHYAY KAUSHIK·Filed 2007·Granted May 8, 2012·31 cites·21 claims
- 1393US8017523B1Deposition of doped copper seed layers having improved reliabilityNOVELLUS SYSTEMS INC·Filed 2008·Granted Sep 13, 2011·27 cites·16 claims
- 1492US11630147B2Low-thermal resistance pressing device for a socketCHROMA ATE INC·Filed 2021·Granted Apr 18, 2023·2 cites·10 claims
- 1592US9418889B2Selective formation of dielectric barriers for metal interconnects in semiconductor devicesLAM RES CORP·Filed 2015·Granted Aug 16, 2016·8 cites·20 claims
- 1691US11987876B2Chamfer-less via integration schemeLAM RES CORP·Filed 2019·Granted May 21, 2024·6 cites·27 claims
- 1791US7704873B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Apr 27, 2010·14 cites·27 claims
- 1891US6605362B2Absorbing compounds for spin-on-glass anti-reflective coatings for photolithographyHONEYWELL INT INC·Filed 2001·Granted Aug 12, 2003·38 cites·20 claims
- 1990US12437995B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Oct 7, 2025·1 cites·5 claims
- 2090US6208014B1Use of multifunctional reagents for the surface modification of nanoporous silica filmsALLIED SIGNAL INC·Filed 1999·Granted Mar 27, 2001·83 cites·10 claims
- 2189US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 2289US8124522B1Reducing UV and dielectric diffusion barrier interaction through the modulation of optical propertiesWU HUI-JUNG·Filed 2008·Granted Feb 28, 2012·31 cites·10 claims
- 2389US6770572B1Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica filmsALLIED SIGNAL INC·Filed 2000·Granted Aug 3, 2004·35 cites·19 claims
- 2489US6489030B1Low dielectric constant films used as copper diffusion barrierHONEYWELL INT INC·Filed 2000·Granted Dec 3, 2002·43 cites·24 claims
- 2588US6518205B1Multifunctional reagents for the surface modification of nanoporous silica filmsALLIED SIGNAL INC·Filed 2000·Granted Feb 11, 2003·34 cites·19 claims
- 2688US6395649B1Low dielectric constant polyorganosilicon coatings generated from polycarbosilanesHONEYWELL INT INC·Filed 2000·Granted May 28, 2002·35 cites·18 claims
- 2787US12417916B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Sep 16, 2025·1 cites·16 claims
- 2887US6318124B1Nanoporous silica treated with siloxane polymers for ULSI applicationsALLIED SIGNAL INC·Filed 1999·Granted Nov 20, 2001·101 cites·19 claims
- 2987US6037275ANanoporous silica via combined stream depositionALLIED SIGNAL INC·Filed 1998·Granted Mar 14, 2000·85 cites·24 claims
- 3085US6914114B2Absorbing compounds for spin-on-glass anti-reflective coatings for photolithographyHONEYWELL INT INC·Filed 2003·Granted Jul 5, 2005·18 cites·16 claims
- 3185US6495906B2Simplified process for producing nanoporous silicaALLIED SIGNAL INC·Filed 2002·Granted Dec 17, 2002·26 cites·40 claims
- 3281US6395651B1Simplified process for producing nanoporous silicaALLIEDSIGNAL·Filed 1998·Granted May 28, 2002·46 cites·35 claims
- 3381US6225238B1Low dielectric constant polyorganosilicon coatings generated from polycarbosilanesALLIED SIGNAL INC·Filed 1999·Granted May 1, 2001·51 cites·8 claims
- 3481US6140254AEdge bead removal for nanoporous dielectric silica coatingsALLIED SIGNAL INC·Filed 1998·Granted Oct 31, 2000·59 cites·24 claims
- 3580US6214746B1Nanoporous material fabricated using a dissolvable reagentHONEYWELL INT INC·Filed 1999·Granted Apr 10, 2001·52 cites·18 claims
- 3680US2025087498A1Tin oxide mandrels in patterningLAM RES CORP·Filed 2024·Application pending·0 cites
- 3777US10199235B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2018·Granted Feb 5, 2019·2 cites·12 claims
- 3871US6780517B2Polycarbosilane adhesion promoters for low dielectric constant polymeric materialsHONEYWELL INT INC·Filed 2002·Granted Aug 24, 2004·13 cites·20 claims
- 3971US2024387258A1Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2024·Application pending·0 cites
- 4070US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 4163US9899234B2Liner and barrier applications for subtractive metal integrationLAM RES CORP·Filed 2014·Granted Feb 20, 2018·1 cites·17 claims
- 4256US6841256B2Low dielectric constant polyorganosilicon materials generated from polycarbosilanesHONEYWELL INT INC·Filed 2002·Granted Jan 11, 2005·4 cites·18 claims
- 4355US11792987B2Self-aligned vertical integration of three-terminal memory devicesLAM RES CORP·Filed 2019·Granted Oct 17, 2023·0 cites·31 claims
- 4454US12080592B2Film stack simplification for high aspect ratio patterning and vertical scalingLAM RES CORP·Filed 2019·Granted Sep 3, 2024·0 cites·8 claims
- 4553US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4650US2025308894A1Hardmask for high aspect ratio dielectric etch at cryo and elevated temperaturesLAM RES CORP·Filed 2023·Application pending·0 cites
- 4748US6761975B1Polycarbosilane adhesion promoters for low dielectric constant polymeric materialsHONEYWELL INT INC·Filed 1999·Granted Jul 13, 2004·13 cites·10 claims
- 4847US2005182151A1Low dielectric constant polyorganosilicon materials generated from polycarbosilanesFiled 2005·Application pending·0 cites
- 4946US12142868B2Chip-fixing device for a socketCHROMA ATE INC·Filed 2021·Granted Nov 12, 2024·0 cites·7 claims
- 5043US2023143057A1Protection of channel layer in three-terminal vertical memory structureLAM RES CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →