Inventor · disambiguated record
Daiji Ikeda
Also filed as: IKEDA DAIJI
7 granted patents·4 pending applications·0 citations·filing 2014–2022
68Inventor score
Top patents by PatentIndex Score
11 records- 0171US12073957B2Conductor materialUNIV TOKYO·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 0262US11267171B2Method of manufacturing composite molded bodyDAICEL POLYMER LTD·Filed 2019·Granted Mar 8, 2022·0 cites·4 claims
- 0357US10322535B2Method of manufacturing composite molded bodyDAICEL POLYMER LTD·Filed 2014·Granted Jun 18, 2019·0 cites·6 claims
- 0456US12046390B2Dopant, electroconductive composition and method for producing sameUNIV TOKYO·Filed 2020·Granted Jul 23, 2024·0 cites·8 claims
- 0551US12358926B2Compound and application thereofDAICEL CORP·Filed 2020·Granted Jul 15, 2025·0 cites·18 claims
- 0650US12049540B2Dopant and conductor materialUNIV TOKYO·Filed 2021·Granted Jul 30, 2024·0 cites·16 claims
- 0749US2023276703A1Organic semiconductor materialUNIV TOKYO·Filed 2021·Application pending·0 cites
- 0849US2024147741A1Inorganic/organic hybrid complementary semiconductor device and method for manufacturing sameUNIV TOKYO·Filed 2022·Application pending·0 cites
- 0947US2024128144A1Sealing material for compounds having non-stoichiometric composition and method for manufacturing sameUNIV TOKYO·Filed 2022·Application pending·0 cites
- 1046US10434741B2Composite molded articleDAICEL POLYMER LTD·Filed 2014·Granted Oct 8, 2019·0 cites·8 claims
- 1144US2019112417A1Novel organic polymer and method for producing sameUNIV TOKYO·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →