Inventor · disambiguated record
Stefan Paulus
Also filed as: PAULUS STEFAN
22 granted patents·8 pending applications·290 citations·filing 2000–2008
95Inventor score
Files withINFINEON TECHNOLOGIES AG21AUBURGER ALBERT3AVAGO TECH FIBER IP SG PTE LTD2DANGELMAIER JOCHEN1LICHTENEGGER THOMAS1
Top patents by PatentIndex Score
30 records- 0193US7453509B2Digital camera with a transparent core disposed between a lens and a light-sensitive sensorINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 18, 2008·88 cites·24 claims
- 0291US7221048B2Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·26 cites·16 claims
- 0388US6969905B2Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devicesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 29, 2005·45 cites·52 claims
- 0484US7622802B2Electronic device with semiconductor chip including a radiofrequency power moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 24, 2009·13 cites·7 claims
- 0582US7705472B2Semiconductor device with semiconductor device components embedded in a plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 27, 2010·14 cites·22 claims
- 0679US7417198B2Radiofrequency power semiconductor module with cavity housing, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 26, 2008·29 cites·28 claims
- 0778US7442559B2Method for producing an optical or electronic module provided with a plastic packageAVAGO TECH FIBER IP SG PTE LTD·Filed 2005·Granted Oct 28, 2008·9 cites·14 claims
- 0877US6694707B2Apparatus and method for populating transport tapesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 24, 2004·17 cites·24 claims
- 0976US7868430B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 11, 2011·7 cites·17 claims
- 1066US6497932B1Transport device for electronic components with an anticontamination coatingINFINEON TECHNOLOGIES AG·Filed 2000·Granted Dec 24, 2002·11 cites·11 claims
- 1163US6784551B2Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 31, 2004·11 cites·9 claims
- 1260US7766560B2Connector module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 3, 2010·2 cites·44 claims
- 1360US7476036B2Optocoupler for converting optical signals into electrical signals and vice versaINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 13, 2009·2 cites·18 claims
- 1458US7597484B2MID module and a method of mounting an optical fibre in an MID moduleAVAGO TECH FIBER IP SG PTE LTD·Filed 2007·Granted Oct 6, 2009·2 cites·11 claims
- 1554US7056764B2Electronic sensor device and method for producing the electronic sensor deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 6, 2006·6 cites·12 claims
- 1654US6576995B2Housing for semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 10, 2003·6 cites·5 claims
- 1750US6895731B2Apparatus for populating transport tapesINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 24, 2005·2 cites·20 claims
- 1848US7354797B2Method for producing a plurality of electronic devicesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 8, 2008·0 cites·6 claims
- 1946US7635612B2Method and use of a device for applying coatings to band-like structures during the production of semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 22, 2009·0 cites·17 claims
- 2046US2006060981A1Production methods for a leadframe and electronic devicesINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2145US2006014326A1Method for fabricating a semiconductor component with contacts situated at the undersideINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2244US2006091561A1Electronic component comprising external surface contacts and a method for producing the sameDANGELMAIER JOCHEN·Filed 2003·Application pending·0 cites
- 2341US7067915B2Electronic device with external contact elements and method for producing a plurality of the devicesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 27, 2006·0 cites·8 claims
- 2440US2006001116A1Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its productionAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2539US7732333B2Process for producing and apparatus for improving the bonding between a plastic and a metalINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 8, 2010·0 cites·26 claims
- 2639US2006049548A1Method for producing an optical or electronic module provided with a plastic package and an optical or electronic moduleAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2739US2006027479A1Optical or electronic module and method for its productionAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2838US8134087B2Electronic or optoelectronic assembly with an electromagnetic screening structure, method for manufacturing sameLICHTENEGGER THOMAS·Filed 2007·Granted Mar 13, 2012·0 cites·17 claims
- 2938US2003015774A1Semiconductor component with contacts situated at the underside, and fabrication methodFiled 2002·Application pending·0 cites
- 3031US2002076852A1Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plasticFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →