Inventor · disambiguated record
Albert Auburger
Also filed as: AUBURGER ALBERT
18 granted patents·6 pending applications·473 citations·filing 1998–2015
95Inventor score
Files withINFINEON TECHNOLOGIES AG14AUBURGER ALBERT3THEUSS HORST3AVAGO TECH FIBER IP SG PTE LTD1SIEMENS AG1
Top patents by PatentIndex Score
24 records- 0197US7385394B2Integrated magnetic sensor componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 10, 2008·108 cites·21 claims
- 0294US7268436B2Electronic device with cavity and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·125 cites·6 claims
- 0392US7793550B2Sensor device including two sensors embedded in a mold materialINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 14, 2010·23 cites·28 claims
- 0492US6867492B2Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·96 cites·10 claims
- 0591US7775115B2Sensor component and method for producing a sensor componentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 17, 2010·25 cites·35 claims
- 0680US6550982B2Optoelectronic surface-mountable module and optoelectronic coupling unitINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 22, 2003·35 cites·11 claims
- 0778US7442559B2Method for producing an optical or electronic module provided with a plastic packageAVAGO TECH FIBER IP SG PTE LTD·Filed 2005·Granted Oct 28, 2008·9 cites·14 claims
- 0876US9859332B2Semiconductor component comprising magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 2, 2018·2 cites·16 claims
- 0972US8767983B2Module including a micro-electro-mechanical microphoneTHEUSS HORST·Filed 2007·Granted Jul 1, 2014·5 cites·39 claims
- 1065US7836764B2Electrical device with coveringINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 23, 2010·3 cites·29 claims
- 1164US9076717B2Semiconductor component comprising magnetic field sensorTHEUSS HORST·Filed 2006·Granted Jul 7, 2015·2 cites·19 claims
- 1263US6784551B2Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 31, 2004·11 cites·9 claims
- 1360US8482135B2Method for producing a component and device having a componentTHEUSS HORST·Filed 2007·Granted Jul 9, 2013·2 cites·23 claims
- 1460US7476036B2Optocoupler for converting optical signals into electrical signals and vice versaINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 13, 2009·2 cites·18 claims
- 1555US7635911B2Chip carrier and system including a chip carrier and semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 22, 2009·1 cites·24 claims
- 1654US7056764B2Electronic sensor device and method for producing the electronic sensor deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 6, 2006·6 cites·12 claims
- 1752US8872314B2Method for producing a component and device comprising a componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 28, 2014·0 cites·16 claims
- 1851US6047604APressure sensor component for mounting on the component-mounting surface of a printed circuit boardSIEMENS AG·Filed 1998·Granted Apr 11, 2000·18 cites·15 claims
- 1945US2006014326A1Method for fabricating a semiconductor component with contacts situated at the undersideINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 2040US2006001116A1Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its productionAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2139US2006049548A1Method for producing an optical or electronic module provided with a plastic package and an optical or electronic moduleAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2239US2006027479A1Optical or electronic module and method for its productionAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 2338US2003015774A1Semiconductor component with contacts situated at the underside, and fabrication methodFiled 2002·Application pending·0 cites
- 2431US2002076852A1Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plasticFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →