Inventor · disambiguated record

George H. Bumgardner

Also filed as: BUMGARDNER GEORGE H

1 granted patent·42 citations·filing 1994–1994

47Inventor score

Technology areasH05K

Files withCOMPAQ COMPUTER CORP1

Top patents by PatentIndex Score

1 record

0168US5511306AMasking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder processCOMPAQ COMPUTER CORP·Filed 1994·Granted Apr 30, 1996·42 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →