Inventor · disambiguated record
Chia-Yang Chen
Also filed as: CHEN CHIA-YANG
28 granted patents·19 pending applications·48 citations·filing 2003–2024
94Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD40CHEN CHIA-YANG1CHEN CHING-HUA1CHUNG SHAN INST OF SCIENCE1LI KUAN-HSING1
Top patents by PatentIndex Score
47 records- 0194US10410970B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 10, 2019·13 cites·19 claims
- 0293US10916526B2Method for fabricating electronic package with conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Feb 9, 2021·4 cites·11 claims
- 0387US11222852B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Jan 11, 2022·4 cites·6 claims
- 0486US12057409B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·22 claims
- 0582US10461041B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 29, 2019·3 cites·10 claims
- 0679US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
- 0779US9508656B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·8 claims
- 0878US7554189B1Wireless communication moduleUNIVERSAL SCIENT IND CO LTD·Filed 2008·Granted Jun 30, 2009·9 cites·6 claims
- 0973US12100641B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·26 claims
- 1072US2025125237A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1171US2024297126A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1269US10199317B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·2 cites·18 claims
- 1367US10643974B2Electronic package with conductive pillarsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted May 5, 2020·1 cites·5 claims
- 1466US9899335B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·1 cites·7 claims
- 1565US12211776B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
- 1665US11749583B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·30 claims
- 1763US11723144B2Electronic device and circuit board thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·4 claims
- 1860US2025226326A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1960US2025183109A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2058US12500181B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 2158US2025293115A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2257US8618655B2Carrier-free semiconductor packageCHEN CHING-HUA·Filed 2011·Granted Dec 31, 2013·1 cites·7 claims
- 2355US2024203900A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2455US2024170415A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 2554US2014203771A1Electronic package, fabrication method thereof and adhesive compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2654US2025038061A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2754US2021351097A1Method for fabricating electronic structure with conductive elements arranged for heating processSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Application pending·0 cites
- 2852US8962396B2Fabrication method of carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 24, 2015·0 cites·11 claims
- 2951US11764162B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Sep 19, 2023·0 cites·18 claims
- 3051US2021005524A1Electronic structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Application pending·0 cites
- 3149US10074613B2Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims
- 3247US11069633B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jul 20, 2021·0 cites·12 claims
- 3347US9490219B2Semiconductor package with shielding member and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·0 cites·16 claims
- 3446US9343401B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·0 cites·18 claims
- 3546US2010109041A1High efficiency led structureYIN CHUN-CHIANG·Filed 2008·Application pending·0 cites
- 3645US10074621B2Electronic package with antenna structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Sep 11, 2018·0 cites·10 claims
- 3744US2004084606A1ScannerFiled 2003·Application pending·0 cites
- 3843US9502377B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·11 claims
- 3942US8725409B2Vehicle navigation system and navigation method thereofCHEN CHIA-YANG·Filed 2009·Granted May 13, 2014·0 cites·18 claims
- 4042US2008207016A1Communications moduleLI KUAN-HSING·Filed 2007·Application pending·0 cites
- 4142US2015123251A1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 4237US9999132B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·11 claims
- 4337US7064611B2IDSS RF amplifierCHUNG SHAN INST OF SCIENCE·Filed 2004·Granted Jun 20, 2006·2 cites·7 claims
- 4436US2020251395A1Electronic structure and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
- 4534US2018047711A1Electronic stack structure having passive elements and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 4632US2016081234A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 4732US2016155559A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →