Inventor · disambiguated record
Seok Hwan Ahn
Also filed as: AHN SEOK H · AHN SEOK-HWAN
13 granted patents·11 pending applications·22 citations·filing 2005–2024
86Inventor score
Top patents by PatentIndex Score
24 records- 0189US9832866B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·7 cites·7 claims
- 0283US10763031B2Method of manufacturing an inductorSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 0377US10045436B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 7, 2018·5 cites·3 claims
- 0473US8215011B2Method of manufacturing a printed circuit boardAHN SEOK HWAN·Filed 2009·Granted Jul 10, 2012·5 cites·6 claims
- 0572US10650958B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2016·Granted May 12, 2020·1 cites·32 claims
- 0671US11600430B2Inductor including high-rigidity insulating layersSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 7, 2023·0 cites·5 claims
- 0765US2024304376A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0865US2024234015A9Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0965US2024347260A1Coil componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1064US2024212922A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1164US2024177909A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1257US8535547B2Printed circuit board manufacturing system and manufacturing method thereofCHO CHUNG-WOO·Filed 2008·Granted Sep 17, 2013·2 cites·2 claims
- 1353US2011156288A1Ultrasonic aroma humidifier capable of facilitating cleaningAHN SEOK HWAN·Filed 2009·Application pending·0 cites
- 1453US2010006446A1Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1552US8604345B2Printed circuit board having plating pattern buried in viaAHN SEOK HWAN·Filed 2012·Granted Dec 10, 2013·0 cites·6 claims
- 1649US2007199735A1Printed circuit board having inner via hole and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1748US9706644B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 11, 2017·0 cites·20 claims
- 1847US10356916B2Printed circuit board with inner layer and outer layers and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 16, 2019·0 cites·19 claims
- 1947US2011138616A1Printed circuit board manufacturing systemSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2046US10455708B2Multilayered substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 22, 2019·0 cites·9 claims
- 2146US7736952B2Wafer packaging methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 15, 2010·0 cites·8 claims
- 2246US2010270067A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2341US2006121255A1Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2438US10098232B2Embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 9, 2018·0 cites·13 claims
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