Inventor · disambiguated record
Min Jung Cho
Also filed as: CHO MIN JUNG
14 granted patents·8 pending applications·8 citations·filing 2009–2024
85Inventor score
Files withSAMSUNG ELECTRO MECH16UIF UNIV INDUSTRY FOUNDATION YONSEI UNIV2HWANG MI-SUN1HYOSUNG CHEMICAL CORP1KANG MYUNG-SAM1
Top patents by PatentIndex Score
22 records- 0197US11694843B2Multilayer capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jul 4, 2023·4 cites·32 claims
- 0293US12027315B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 2, 2024·1 cites·44 claims
- 0386US12354800B2Multilayer capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Granted Jul 8, 2025·0 cites·26 claims
- 0485US11715595B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 1, 2023·1 cites·19 claims
- 0579US12230443B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 18, 2025·0 cites·6 claims
- 0678US12148570B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 19, 2024·0 cites·16 claims
- 0770US11664162B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 30, 2023·0 cites·14 claims
- 0865US12057271B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 6, 2024·0 cites·22 claims
- 0964US12380031B2Method and apparatus for designing cache memory structure based on artificial intelligenceUIF UNIV INDUSTRY FOUNDATION YONSEI UNIV·Filed 2023·Granted Aug 5, 2025·0 cites·13 claims
- 1063US11791095B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 1159US8881381B2Method of manufacturing printed circuit boardHWANG MI SUN·Filed 2009·Granted Nov 11, 2014·2 cites·6 claims
- 1256US11715602B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 1, 2023·0 cites·23 claims
- 1356US2025190346A1Method for generating training data for cache memory design based on artificial intelligence and system using sameUIF UNIV INDUSTRY FOUNDATION YONSEI UNIV·Filed 2024·Application pending·0 cites
- 1452US2011061906A1Printed circuit board and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1551US11322302B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted May 3, 2022·0 cites·17 claims
- 1650US2025157741A1Multilayered capacitorSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1747US2011061912A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1847US2011067233A1Method of fabricating printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1947US2014090245A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2042US2010314755A1Printed circuit board, semiconductor device comprising the same, and method of manufacturing the sameKANG MYUNG SAM·Filed 2009·Application pending·0 cites
- 2133US11130721B2Method for collecting hard olefinHYOSUNG CHEMICAL CORP·Filed 2017·Granted Sep 28, 2021·0 cites·13 claims
- 2230US2012298412A1Printed circuit board and method of manufacturing the sameMUN KYUNG DON·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →