Inventor · disambiguated record
Mi Sun Hwang
Also filed as: HWANG MI SUN
26 granted patents·18 pending applications·41 citations·filing 2008–2024
93Inventor score
Top patents by PatentIndex Score
44 records- 0195US9899136B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 20, 2018·11 cites·29 claims
- 0289US9832866B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·7 cites·7 claims
- 0387US8928234B2Lighting apparatusKIM JI YOUNG·Filed 2010·Granted Jan 6, 2015·11 cites·16 claims
- 0483US11183462B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0578US11910527B2Substrate with electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 20, 2024·1 cites·21 claims
- 0675US11076487B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·1 cites·20 claims
- 0775US10304628B2Multilayer capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted May 28, 2019·1 cites·16 claims
- 0874US10887986B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 5, 2021·1 cites·16 claims
- 0974US2023354513A1Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1072US10650958B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2016·Granted May 12, 2020·1 cites·32 claims
- 1170US10849226B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 24, 2020·1 cites·10 claims
- 1270US10779409B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 15, 2020·1 cites·15 claims
- 1369US11744012B2Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 1460US8720048B2Method of manufacturing a printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted May 13, 2014·0 cites·8 claims
- 1560US8418361B2Method of manufacturing printed circuit board having landless via holeLEE SUK WON·Filed 2011·Granted Apr 16, 2013·1 cites·5 claims
- 1659US8881381B2Method of manufacturing printed circuit boardHWANG MI SUN·Filed 2009·Granted Nov 11, 2014·2 cites·6 claims
- 1758US11013114B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1857US11528804B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 13, 2022·0 cites·22 claims
- 1957US2025194004A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2056US8541096B2Printed circuit board and method of manufacturing the sameHWANG MI SUN·Filed 2009·Granted Sep 24, 2013·0 cites·7 claims
- 2155US11017930B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 2254US2009255722A1Printed circuit board having landless via hole and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2354US2009288872A1Printed circuit board including outmost fine circuit pattern and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2452US11631643B2Substrate embedded electronic component packageSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 2552US2012011716A1Method of manufacturing printed circuit board including outmost fine circuit patternKIM HAN·Filed 2011·Application pending·0 cites
- 2652US2011061906A1Printed circuit board and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2750US11763982B2Inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 19, 2023·0 cites·15 claims
- 2850US2015136446A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2949US2009260868A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3048US9706644B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 11, 2017·0 cites·20 claims
- 3147US2011061912A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3247US2011067233A1Method of fabricating printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3347US2014090245A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3446US10455708B2Multilayered substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 22, 2019·0 cites·9 claims
- 3546US2012225521A1Board on chip package substrate and manufacturing method thereofHWANG MI-SUN·Filed 2012·Application pending·0 cites
- 3645US2014089841A1Device and method for providing application interface based on writing inputPANTECH CO LTD·Filed 2013·Application pending·0 cites
- 3745US2014089855A1Method and device for executing a specific operation based on writingPANTECH CO LTD·Filed 2013·Application pending·0 cites
- 3845US2011186997A1Board on chip package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3944US12389546B2Printed circuit board, electronic component-embedded substrate, and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 12, 2025·0 cites·13 claims
- 4043US11640952B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·19 claims
- 4142US2010314755A1Printed circuit board, semiconductor device comprising the same, and method of manufacturing the sameKANG MYUNG SAM·Filed 2009·Application pending·0 cites
- 4242US2018280578A1Bio-ink composition having improved physical and biological propertiesBIOINK SOLUTIONS INC·Filed 2016·Application pending·0 cites
- 4337US8415200B2Method for manufacturing semiconductor packageHWANG MI SUN·Filed 2011·Granted Apr 9, 2013·0 cites·17 claims
- 4428US2012103671A1Printed circuit board and method for manufacturing the sameLEE EUNG SUEK·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →