Inventor · disambiguated record
Attila Lengyel
Also filed as: LENGYEL ATTILA · LENGYEL ATTILA JOZSEF
9 granted patents·2 pending applications·84 citations·filing 2001–2018
85Inventor score
Files withMIDE TECHNOLOGY CORP3ABNAKI SYSTEMS INC1HITACHI HIGH TECH INSTR CO LTD1LENGYEL ATTILA1MIDE TECH CORP1
Top patents by PatentIndex Score
11 records- 0188US6550341B2Method and device for measuring strain using shape memory alloy materialsMIDE TECHNOLOGY CORP·Filed 2001·Granted Apr 22, 2003·38 cites·30 claims
- 0276US7167009B2Method and apparatus for determining electrical properties of structuresMIDE TECHNOLOGY CORP·Filed 2004·Granted Jan 23, 2007·20 cites·27 claims
- 0374US6802216B2Method and sheet like sensor for measuring stress distributionMIDE TECHNOLOGY·Filed 2002·Granted Oct 12, 2004·21 cites·42 claims
- 0462US8600535B2Device for calculating standard work time, system for managing standard work time, method for calculating standard work time, and program thereofNONAKA YOUICHI·Filed 2009·Granted Dec 3, 2013·1 cites·9 claims
- 0557US7885723B2Setting device, component mounting system, program and calculating methodHITACHI HIGH TECH INSTR CO LTD·Filed 2007·Granted Feb 8, 2011·2 cites·10 claims
- 0656US9180326B2Method and apparatus for thermally activated sprinklersVAN SCHOOR MARTHINUS CORNELIUS·Filed 2009·Granted Nov 10, 2015·2 cites·10 claims
- 0747US9631744B2Aerial refueling hoseMIDE TECH CORP·Filed 2014·Granted Apr 25, 2017·0 cites·12 claims
- 0844US8825190B2Priority calculation device, program, priority calculation system, and priority calculation methodLENGYEL ATTILA·Filed 2009·Granted Sep 2, 2014·0 cites·11 claims
- 0937US10871237B2Dual stage pressure relief valveOATEY CO·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 1036US2004025985A1Energy absorbing shape memory alloysMIDE TECHNOLOGY CORP·Filed 2003·Application pending·0 cites
- 1135US2007006652A1Load measuring sensor and methodABNAKI SYSTEMS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →