Inventor · disambiguated record
Hideki Kitada
Also filed as: KITADA HIDEKI
31 granted patents·8 pending applications·337 citations·filing 1986–2020
96Inventor score
Files withFUJITSU LTD19SUMITOMO ELECTRIC INDUSTRIES6FUJITSU MICROELECTRONICS LTD3FUJITSU SEMICONDUCTOR LTD3KITADA HIDEKI3
Top patents by PatentIndex Score
39 records- 0196US7507666B2Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main compositionFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 24, 2009·49 cites·7 claims
- 0292US7413977B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodFUJITSU LTD·Filed 2005·Granted Aug 19, 2008·17 cites·4 claims
- 0391US8319277B2Semiconductor device, method of manufacturing same, and apparatus for designing sameKITADA HIDEKI·Filed 2010·Granted Nov 27, 2012·15 cites·9 claims
- 0490US7611984B2Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloyFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Nov 3, 2009·17 cites·9 claims
- 0590US7416985B2Semiconductor device having a multilayer interconnection structure and fabrication method thereofFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·29 cites·10 claims
- 0689US7670925B2Semiconductor device, method of manufacturing same, and apparatus for designing sameFUJITSU LTD·Filed 2007·Granted Mar 2, 2010·15 cites·4 claims
- 0787US7868456B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2008·Granted Jan 11, 2011·11 cites·4 claims
- 0887US6242808B1Semiconductor device with copper wiring and semiconductor device manufacturing methodFUJITSU LTD·Filed 1998·Granted Jun 5, 2001·87 cites·10 claims
- 0985US7846833B2Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor deviceFUJITSU LTD·Filed 2010·Granted Dec 7, 2010·7 cites·7 claims
- 1084US8540220B2Air spring for vehicle and railway truck for vehicleSAWA TAKAYUKI·Filed 2010·Granted Sep 24, 2013·12 cites·16 claims
- 1184US6257561B1Air springSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Jul 10, 2001·46 cites·3 claims
- 1282US8071474B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodSHIMIZU NORIYOSHI·Filed 2010·Granted Dec 6, 2011·4 cites·7 claims
- 1381US7795141B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Sep 14, 2010·5 cites·2 claims
- 1473US7713869B2Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor deviceFUJITSU LTD·Filed 2005·Granted May 11, 2010·5 cites·5 claims
- 1569US10449979B2Air spring and bogieSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Oct 22, 2019·1 cites·9 claims
- 1667US9202752B2Semiconductor device with first and second semiconductor substratesKITADA HIDEKI·Filed 2010·Granted Dec 1, 2015·2 cites·4 claims
- 1766US10563719B2Air spring and bogieSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Feb 18, 2020·1 cites·10 claims
- 1865US10435044B2Air spring and bogieSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Oct 8, 2019·1 cites·6 claims
- 1960US7871924B2Semiconductor device having copper wiringFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Jan 18, 2011·1 cites·8 claims
- 2055US2010007023A1Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloyFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 2153US11195577B2Switch element and method for manufacturing switch elementFUJITSU LTD·Filed 2020·Granted Dec 7, 2021·0 cites·14 claims
- 2252US7329952B2Method of fabricating a semiconductor deviceFUJITSU LTD·Filed 2004·Granted Feb 12, 2008·3 cites·4 claims
- 2350US7279790B2Semiconductor device and a manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Oct 9, 2007·4 cites·6 claims
- 2450US7205667B2Semiconductor device having copper wiringFUJITSU LTD·Filed 2004·Granted Apr 17, 2007·3 cites·7 claims
- 2549US8383509B2Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy and semiconductor device of this kindFUJITSU SEMICONDUCTOR LTD·Filed 2011·Granted Feb 26, 2013·0 cites·7 claims
- 2647US10383229B2Electronic apparatus, fabrication method therefor and electronic partFUJITSU LTD·Filed 2018·Granted Aug 13, 2019·0 cites·20 claims
- 2746US10597050B2Air spring and bogieSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Mar 24, 2020·0 cites·13 claims
- 2846US2017110369A1Electronic device and method for producing sameFUJITSU LTD·Filed 2016·Application pending·0 cites
- 2943US10538257B2Air spring and bogieSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jan 21, 2020·0 cites·8 claims
- 3043US2013093092A1Electronic device and method for producing sameKANKI TSUYOSHI·Filed 2012·Application pending·0 cites
- 3142US10319667B2Electronic device and method of fabricating the sameFUJITSU LTD·Filed 2017·Granted Jun 11, 2019·0 cites·12 claims
- 3242US2019192036A1Electronic device and method of manufacturing electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 3341US10008436B2Semiconductor deviceFUJITSU LTD·Filed 2016·Granted Jun 26, 2018·0 cites·9 claims
- 3441US2007273156A1Wave Power GeneratorMIYAJIMA KOJI·Filed 2004·Application pending·0 cites
- 3538US2018174906A1Semiconductor device and method of manufacturing the same, and stacked semiconductor deviceFUJITSU LTD·Filed 2017·Application pending·0 cites
- 3637US8836122B2Semiconductor device having copper wiring with increased migration resistanceKITADA HIDEKI·Filed 2010·Granted Sep 16, 2014·0 cites·12 claims
- 3737US2018012999A1Semiconductor device and electronic apparatusFUJITSU LTD·Filed 2017·Application pending·0 cites
- 3836US2016351499A1Semiconductor device and electronic deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3930US4808642AChlorine-containing resin molding and material for use therewithTAKIRON CO·Filed 1986·Granted Feb 28, 1989·2 cites·8 claims
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