Inventor · disambiguated record
Cheng-Yu Lin
Also filed as: LIN CHENG Y · LIN CHENG YU · LIN CHENG-HAO · LIN CHENG-YU SEAN
62 granted patents·26 pending applications·228 citations·filing 1996–2025
98Inventor score
Files withBLOOM ENERGY CORP23TAIWAN SEMICONDUCTOR MFG CO LTD18KHOLODENKO ARNOLD8DELTA ELECTRONICS INC6LAM RES CORP5
Top patents by PatentIndex Score
88 records- 0198US11715733B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·4 cites·20 claims
- 0295US10593962B2Pre-formed powder delivery to powder press machineBLOOM ENERGY CORP·Filed 2016·Granted Mar 17, 2020·18 cites·8 claims
- 0392US12142637B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·2 cites·20 claims
- 0492US10511047B2Anode splitter plate and methods for making the sameBLOOM ENERGY CORP·Filed 2017·Granted Dec 17, 2019·8 cites·19 claims
- 0590US11355762B2Cross-flow interconnect and fuel cell system including sameBLOOM ENERGY CORP·Filed 2019·Granted Jun 7, 2022·6 cites·20 claims
- 0688US11705557B2Interconnect for fuel cell stackBLOOM ENERGY CORP·Filed 2021·Granted Jul 18, 2023·1 cites·11 claims
- 0787US12381232B2Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columnsBLOOM ENERGY CORP·Filed 2024·Granted Aug 5, 2025·0 cites·2 claims
- 0887US2025030012A1Fuel cell interconnect optimized for operation in hydrogen fuelBLOOM ENERGY CORP·Filed 2024·Application pending·0 cites
- 0986US8317934B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2009·Granted Nov 27, 2012·10 cites·14 claims
- 1086US2025349866A1Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columnsBLOOM ENERGY CORP·Filed 2025·Application pending·0 cites
- 1184US8757177B2Multi-stage substrate cleaning method and apparatusKHOLODENKO ARNOLD·Filed 2012·Granted Jun 24, 2014·6 cites·17 claims
- 1284US2025359221A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1382US10921861B2Electronic device including luminous stripASUSTEK COMP INC·Filed 2020·Granted Feb 16, 2021·2 cites·10 claims
- 1481US12489432B2Integrated circuit device, method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1581US12336295B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1681US9958406B1Method of measurement and estimation of the coefficient of thermal expansion in componentsBLOOM ENERGY CORP·Filed 2014·Granted May 1, 2018·3 cites·11 claims
- 1781US2025287698A1Integrated circuit device and non-transitory computer-readable recording medium storing cell layout for integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1880US12132234B2Fuel cell interconnect optimized for operation in hydrogen fuelBLOOM ENERGY CORP·Filed 2022·Granted Oct 29, 2024·0 cites·21 claims
- 1980US12027728B2Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columnsBLOOM ENERGY CORP·Filed 2022·Granted Jul 2, 2024·0 cites·13 claims
- 2080US10873092B2Fuel cell interconnect with reduced voltage degradation and manufacturing methodBLOOM ENERGY CORP·Filed 2018·Granted Dec 22, 2020·1 cites·11 claims
- 2180US9502721B2Pre-formed powder delivery to powder press machineBLOOM ENERGY CORP·Filed 2014·Granted Nov 22, 2016·2 cites·3 claims
- 2279US9468736B2Fuel cell interconnect with reduced voltage degradation over timeBLOOM ENERGY CORP·Filed 2014·Granted Oct 18, 2016·10 cites·22 claims
- 2378US2025048693A1Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2477US7509183B2Integrated global layout and local microstructure topology optimization approach for spinal cage design and fabricationUNIV MICHIGAN·Filed 2004·Granted Mar 24, 2009·70 cites·20 claims
- 2577US2025342301A1Integrated circuit design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676US2025311439A1Layout design for header cell in 3d integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775USD610278SLED lampDELTA ELECTRONICS INC·Filed 2009·Granted Feb 16, 2010·20 cites·1 claims
- 2875US2024332174A1Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2974US11217797B2Interconnect for fuel cell stackBLOOM ENERGY CORP·Filed 2013·Granted Jan 4, 2022·1 cites·21 claims
- 3074US10756355B2Systems and methods for recycling fuel cell stack componentsBLOOM ENERGY CORP·Filed 2017·Granted Aug 25, 2020·2 cites·19 claims
- 3174US2024332560A1Electrochemical cell stacks including interconnect end platesBLOOM ENERGY CORP·Filed 2024·Application pending·0 cites
- 3274US2025291997A1Semiconductor device and method and system of arranging patterns of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3373US9038661B2Valve deviceLIN CHENG-YU·Filed 2012·Granted May 26, 2015·6 cites·11 claims
- 3472US11979158B2Integrated circuit device, method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 3571US11916263B2Cross-flow interconnect and fuel cell system including sameBLOOM ENERGY CORP·Filed 2022·Granted Feb 27, 2024·0 cites·11 claims
- 3670US10611197B2Method of building vehicle data in tire pressure diagnosis toolCUB ELECPARTS INC·Filed 2017·Granted Apr 7, 2020·4 cites·3 claims
- 3768US11962041B2Methods for manufacturing fuel cell interconnects using 3D printingBLOOM ENERGY CORP·Filed 2021·Granted Apr 16, 2024·0 cites·18 claims
- 3868US11335914B2Fuel cell interconnect with iron rich rib regions and method of making thereofBLOOM ENERGY CORP·Filed 2020·Granted May 17, 2022·0 cites·9 claims
- 3966US12346645B2Semiconductor device and method and system of arranging patterns of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 4066US12216359B2Spliced reflective displayIRIS OPTRONICS CO LTD·Filed 2024·Granted Feb 4, 2025·0 cites·10 claims
- 4165US12382724B2Layout design for header cell in 3D integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 5, 2025·0 cites·20 claims
- 4265US12014982B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 4365US11456464B2Fuel cell interconnect with reduced voltage degradation and manufacturing methodBLOOM ENERGY CORP·Filed 2020·Granted Sep 27, 2022·0 cites·22 claims
- 4465US10962492B2Method of measurement and estimation of the coefficient of thermal expansion in componentsBLOOM ENERGY CORP·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
- 4565US8900400B2Proximity head having a fluid resistorLAM RES CORP·Filed 2012·Granted Dec 2, 2014·1 cites·12 claims
- 4665US8584613B2Single substrate processing head for particle removal using low viscosity fluidKHOLODENKO ARNOLD·Filed 2008·Granted Nov 19, 2013·2 cites·6 claims
- 4765US2024086609A1Integrated circuit design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4864US2024332561A1Fuel cell interconnect including fuel channels having different cross-sectional areasBLOOM ENERGY CORP·Filed 2024·Application pending·0 cites
- 4963US8161984B2Generator for foam to clean substrateKHOLODENKO ARNOLD·Filed 2008·Granted Apr 24, 2012·1 cites·15 claims
- 5063US8150092B2Speaker module of electronic deviceHUANG MING-SHUO·Filed 2009·Granted Apr 3, 2012·4 cites·8 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →