Inventor · disambiguated record
Tsuyoshi Himori
Also filed as: HIMORI TSUYOSHI
12 granted patents·8 pending applications·118 citations·filing 1998–2013
90Inventor score
Files withPANASONIC CORP7HIMORI TSUYOSHI4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4HIRAI SHOGO2HIGUCHI TAKAYUKI1
Top patents by PatentIndex Score
20 records- 0189US7659604B2Module component and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Feb 9, 2010·22 cites·12 claims
- 0286US6806428B1Module component and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 19, 2004·37 cites·15 claims
- 0381US8563872B2Wiring board, wiring board manufacturing method, and via pasteHIRAI SHOGO·Filed 2011·Granted Oct 22, 2013·8 cites·17 claims
- 0471US8604350B2Multilayer wiring substrate and manufacturing method of multilayer wiring substrateHIMORI TSUYOSHI·Filed 2011·Granted Dec 10, 2013·3 cites·15 claims
- 0568US6879493B2Module component and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 12, 2005·11 cites·21 claims
- 0667US6166620AResistance wiring board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 26, 2000·28 cites·21 claims
- 0763US8393078B2Method of manufacturing circuit boardHIMORI TSUYOSHI·Filed 2012·Granted Mar 12, 2013·1 cites·4 claims
- 0863US7667977B2Mounting board, mounted body, and electronic equipment using the samePANASONIC CORP·Filed 2006·Granted Feb 23, 2010·2 cites·19 claims
- 0962US8561294B2Method of manufacturing circuit boardHIMORI TSUYOSHI·Filed 2012·Granted Oct 22, 2013·1 cites·18 claims
- 1057US8658910B2Circuit board and method of manufacturing the circuit boardKUBO TETSURO·Filed 2012·Granted Feb 25, 2014·1 cites·10 claims
- 1155US2013327994A1Method of manufacturing reuse paste, reuse paste and method of manufacturing circuit board using reuse pastePANASONIC CORP·Filed 2013·Application pending·0 cites
- 1255US2013327478A1Method of manufacturing reuse paste, reuse paste and method of manufacturing circuit board using reuse pastePANASONIC CORP·Filed 2013·Application pending·0 cites
- 1354US2013299752A1Reuse paste manufacturing method and reuse pastePANASONIC CORP·Filed 2013·Application pending·0 cites
- 1451US2013153138A1Method of manufacturing reuse paste, reuse paste and method of manufacturing circuit board using reuse pasteHIMORI TSUYOSHI·Filed 2012·Application pending·0 cites
- 1549US7510759B2Electronic part and manufacturing method thereofPANASONIC CORP·Filed 2004·Granted Mar 31, 2009·3 cites·13 claims
- 1645US7421781B2Method of forming a module component having a plurality of penetration holesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 9, 2008·1 cites·4 claims
- 1744US2013008698A1Multilayer wiring board, production method of the same, and via pastePANASONIC CORP·Filed 2011·Application pending·0 cites
- 1840US2014124250A1Wiring board and method for manufacturing sameIWASAKI AKITO·Filed 2012·Application pending·0 cites
- 1939US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites
- 2036US2013062107A1Multilayer wiring board and production method of the sameHIGUCHI TAKAYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →