Inventor · disambiguated record
Mikiharu Hibi
Also filed as: HIBI MIKIHARU
8 granted patents·3 pending applications·86 citations·filing 2004–2007
86Inventor score
Files withTDK CORP11
Top patents by PatentIndex Score
11 records- 0194US7352529B2Magnetic recording medium and magnetic recording and reproducing device using a magnetic recording layer formed with a predetermined concavo-convex patternTDK CORP·Filed 2005·Granted Apr 1, 2008·22 cites·11 claims
- 0292US7488429B2Method of dry etching, method of manufacturing magnetic recording medium, and magnetic recording mediumTDK CORP·Filed 2005·Granted Feb 10, 2009·19 cites·20 claims
- 0384US7300595B2Method for filling concave portions of concavo-convex pattern and method for manufacturing magnetic recording mediumTDK CORP·Filed 2004·Granted Nov 27, 2007·18 cites·16 claims
- 0484US7247251B2Method for manufacturing a magnetic recording mediumTDK CORP·Filed 2005·Granted Jul 24, 2007·6 cites·5 claims
- 0581US7273563B2Method for manufacturing a magnetic recording mediumTDK CORP·Filed 2005·Granted Sep 25, 2007·11 cites·12 claims
- 0679US7378029B2Method for manufacturing magnetic recording mediumTDK CORP·Filed 2005·Granted May 27, 2008·4 cites·2 claims
- 0772US7438982B2Magnetic recording medium including disk substrate, magnetic layer, and non-magnetic layerTDK CORP·Filed 2005·Granted Oct 21, 2008·6 cites·17 claims
- 0855US7829267B2Stamper, method of forming a concave/convex pattern, and method of manufacturing an information recording mediumTDK CORP·Filed 2007·Granted Nov 9, 2010·0 cites·12 claims
- 0950US2008078739A1Method for manufacturing magnetic recording mediumTDK CORP·Filed 2007·Application pending·0 cites
- 1049US2007145613A1Concave/convex pattern forming method and information recording medium manufacturing methodTDK CORP·Filed 2006·Application pending·0 cites
- 1142US2005060874A1Method for processing work piece including magnetic material and method for manufacturing magnetic recording mediumTDK CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →