Inventor · disambiguated record
Lewis S. Goldmann
Also filed as: GOLDMANN LEWIS S · GOLDMANN LEWIS SIGMUND
35 granted patents·1,406 citations·filing 1995–2012
98Inventor score
Top patents by PatentIndex Score
35 records- 0197US5800184AHigh density electrical interconnect apparatus and methodIBM·Filed 1995·Granted Sep 1, 1998·226 cites·31 claims
- 0294US7518235B2Method and structure to provide balanced mechanical loading of devices in compressively loaded environmentsIBM·Filed 2005·Granted Apr 14, 2009·42 cites·6 claims
- 0394US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0492US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0588US7095614B2Electronic module assemblyIBM·Filed 2004·Granted Aug 22, 2006·52 cites·20 claims
- 0688US6458623B1Conductive adhesive interconnection with insulating polymer carrierIBM·Filed 2001·Granted Oct 1, 2002·45 cites·29 claims
- 0787US6287126B1Mechanical attachment means used as electrical connectionIBM·Filed 1999·Granted Sep 11, 2001·58 cites·48 claims
- 0887US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 0986US7443026B2IC chip package having force-adjustable member between stiffener and printed circuit boardIBM·Filed 2006·Granted Oct 28, 2008·12 cites·12 claims
- 1084US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 1183US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
- 1282US8107800B2Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processingBEZAMA RASCHID J·Filed 2008·Granted Jan 31, 2012·9 cites·6 claims
- 1381US7566649B2Compressible films surrounding solder connectorsIBM·Filed 2007·Granted Jul 28, 2009·8 cites·19 claims
- 1481US6333104B1Conductive polymer interconnection configurationsIBM·Filed 2000·Granted Dec 25, 2001·21 cites·22 claims
- 1581US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1680US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 1779US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 1878US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 1975US6459160B1Package with low stress hermetic sealIBM·Filed 2002·Granted Oct 1, 2002·19 cites·26 claims
- 2074US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 2174US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 2271US6342407B1Low stress hermetic sealIBM·Filed 2000·Granted Jan 29, 2002·15 cites·20 claims
- 2370US8132775B2Solder mold plates used in packaging process and method of manufacturing solder mold platesGOLDMANN LEWIS S·Filed 2008·Granted Mar 13, 2012·4 cites·14 claims
- 2468US8337735B2Solder mold plates used in packaging process and method of manufacturing solder mold platesGOLDMANN LEWIS S·Filed 2012·Granted Dec 25, 2012·2 cites·10 claims
- 2568US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 2667US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 2766US6462271B2Capping structure for electronics package undergoing compressive socket actuationIBM·Filed 2000·Granted Oct 8, 2002·13 cites·32 claims
- 2865US6858111B2Conductive polymer interconnection configurationsIBM·Filed 2001·Granted Feb 22, 2005·9 cites·17 claims
- 2962US6955543B2Method and apparatus to form a reworkable seal on an electronic moduleIBM·Filed 2003·Granted Oct 18, 2005·11 cites·24 claims
- 3062US6333209B1One step method for curing and joining BGA solder ballsIBM·Filed 1999·Granted Dec 25, 2001·27 cites·14 claims
- 3160US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 3258US7332821B2Compressible films surrounding solder connectorsIBM·Filed 2004·Granted Feb 19, 2008·7 cites·21 claims
- 3352US6258191B1Method and materials for increasing the strength of crystalline ceramicIBM·Filed 1998·Granted Jul 10, 2001·18 cites·7 claims
- 3448US6724203B1Full wafer test configuration using memory metalsIBM·Filed 1997·Granted Apr 20, 2004·13 cites·22 claims
- 3535US5691467AMethod for mapping surfaces adapted for receiving electrical componentsIBM·Filed 1996·Granted Nov 25, 1997·5 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →