Inventor · disambiguated record
Yan-Heng Chen
Also filed as: CHEN YAN · CHEN YAN-HENG
23 granted patents·5 pending applications·72 citations·filing 2005–2023
92Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD18TENCENT TECH SHENZHEN CO LTD5CHEN YAN-HENG1HEWLETT PACKARD DEVELOPMENT CO1IBM1
Top patents by PatentIndex Score
28 records- 0190US7774418B2Method, system and client for transmitting preview message in instant messaging systemTENCENT TECH SHENZHEN CO LTD·Filed 2007·Granted Aug 10, 2010·48 cites·23 claims
- 0288US9589841B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 7, 2017·6 cites·16 claims
- 0379US10423978B2Method and device for playing advertisements based on relationship information between viewersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 24, 2019·3 cites·20 claims
- 0476US11310223B2Identity authentication method and apparatusTENCENT TECH SHENZHEN CO LTD·Filed 2020·Granted Apr 19, 2022·1 cites·20 claims
- 0575US8828796B1Semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 0673US9899303B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 20, 2018·2 cites·11 claims
- 0772US9842758B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 12, 2017·2 cites·5 claims
- 0867US9666536B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 30, 2017·1 cites·12 claims
- 0962US9548219B2Semiconductor package and fabrication method thereof and carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jan 17, 2017·2 cites·22 claims
- 1062US9397081B2Fabrication method of semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 19, 2016·1 cites·12 claims
- 1160US9177859B2Semiconductor package having embedded semiconductor elementsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·10 claims
- 1256US8829672B2Semiconductor package, package structure and fabrication method thereofCHEN YAN-HENG·Filed 2012·Granted Sep 9, 2014·1 cites·14 claims
- 1352US10701066B2Identity authentication method and apparatusTENCENT TECH SHENZHEN CO LTD·Filed 2017·Granted Jun 30, 2020·0 cites·17 claims
- 1452US9117698B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 1551US10403567B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 1648US2017236783A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1747US10412299B2Taking personalized photosIBM·Filed 2017·Granted Sep 10, 2019·0 cites·19 claims
- 1847US9768140B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Sep 19, 2017·0 cites·11 claims
- 1947US2024289135A1Basic input/output system setting information presentationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 2045US9224646B2Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 29, 2015·0 cites·8 claims
- 2144US9607941B2Conductive via structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·16 claims
- 2243US9337061B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 2343US2015149383A1Method and device for acquiring product information, and computer storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2013·Application pending·0 cites
- 2442US9479566B2Method and apparatus for downloading web page contentTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Oct 25, 2016·0 cites·14 claims
- 2541US2014134797A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2639US2014183721A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2736US9515040B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·15 claims
- 2835US9002743B2Method, system and server for managing data transmissionTANG MU·Filed 2005·Granted Apr 7, 2015·0 cites·9 claims
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