Inventor · disambiguated record
Rodney L. Robison
Also filed as: ROBISON RODNEY · ROBISON RODNEY L · ROBISON RODNEY LEE
20 granted patents·7 pending applications·339 citations·filing 1993–2024
94Inventor score
Top patents by PatentIndex Score
27 records- 0195US6755945B2Ionized PVD with sequential deposition and etchingTOKYO ELECTRON LTD·Filed 2002·Granted Jun 29, 2004·108 cites·43 claims
- 0294US8028655B2Plasma processing system with locally-efficient inductive plasma couplingTOKYO ELECTRON LTD·Filed 2010·Granted Oct 4, 2011·7 cites·7 claims
- 0390US8194384B2High temperature electrostatic chuck and method of usingNASMAN RONALD·Filed 2008·Granted Jun 5, 2012·27 cites·37 claims
- 0490US5408322ASelf aligning in-situ ellipsometer and method of using for process monitoringMATERIALS RESEARCH CORP·Filed 1993·Granted Apr 18, 1995·99 cites·21 claims
- 0589US7810449B2Plasma processing system with locally-efficient inductive plasma couplingTOKYO ELECTRON LTD·Filed 2007·Granted Oct 12, 2010·8 cites·3 claims
- 0680US10403501B2High-purity dispense systemTOKYO ELECTRON LTD·Filed 2017·Granted Sep 3, 2019·3 cites·18 claims
- 0776US7273533B2Plasma processing system with locally-efficient inductive plasma couplingTOKYO ELECTRON LTD·Filed 2003·Granted Sep 25, 2007·8 cites·11 claims
- 0874US12341053B2System for backside deposition of a substrateTOKYO ELECTRON LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0974US6183615B1Transport system for wafer processing lineTOKYO ELECTRON LTD·Filed 1995·Granted Feb 6, 2001·59 cites·23 claims
- 1073US12506019B2Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor waferTOKYO ELECTRON LTD·Filed 2024·Granted Dec 23, 2025·0 cites·22 claims
- 1172US2025285884A1Wet Processing Systems Having Novel Wafer Chuck Designs For Retaining A Processing Liquid On A Surface Of A Semiconductor SubstrateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1270US7776748B2Selective-redeposition structures for calibrating a plasma processTOKYO ELECTRON LTD·Filed 2006·Granted Aug 17, 2010·3 cites·19 claims
- 1370US7591935B2Enhanced reliability deposition baffle for iPVDTOKYO ELECTRON LTD·Filed 2005·Granted Sep 22, 2009·2 cites·10 claims
- 1465US7772110B2Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processingTOKYO ELECTRON LTD·Filed 2007·Granted Aug 10, 2010·3 cites·9 claims
- 1558US11383211B2Point-of-use dynamic concentration delivery system with high flow and high uniformityTOKYO ELECTRON LTD·Filed 2019·Granted Jul 12, 2022·0 cites·20 claims
- 1658US7744735B2Ionized PVD with sequential deposition and etchingTOKYO ELECTRON LTD·Filed 2004·Granted Jun 29, 2010·6 cites·30 claims
- 1757US2025308950A1Wafer processing method and system using heated functional plateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1856US2009242385A1Method of depositing metal-containing films by inductively coupled physical vapor depositionTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 1955US2009242383A1Apparatus and method for rf grounding of ipvd tableTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2054US11908728B2System for backside deposition of a substrateTOKYO ELECTRON LTD·Filed 2018·Granted Feb 20, 2024·0 cites·20 claims
- 2154US7901545B2Ionized physical vapor deposition (iPVD) processTOKYO ELECTRON LTD·Filed 2004·Granted Mar 8, 2011·6 cites·12 claims
- 2249US7749398B2Selective-redeposition sources for calibrating a plasma processTOKYO ELECTRON LTD·Filed 2006·Granted Jul 6, 2010·0 cites·35 claims
- 2349US2009321247A1IONIZED PHYSICAL VAPOR DEPOSITION (iPVD) PROCESSTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2445US10426001B2Processing system for electromagnetic wave treatment of a substrate at microwave frequenciesTOKYO ELECTRON LTD·Filed 2014·Granted Sep 24, 2019·0 cites·14 claims
- 2538US10354872B2High-precision dispense system with meniscus controlTOKYO ELECTRON LTD·Filed 2017·Granted Jul 16, 2019·0 cites·18 claims
- 2636US2018066363A1Vortical atomizing nozzle assembly, vaporizer, and related methods for substrate processing systemsTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 2734US2015211836A1Systems and Methods for Generating Backside Substrate Texture Maps for Determining Adjustments for Front Side PatterningTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →