Inventor · disambiguated record
Kiangkai Tankongchumruskul
Also filed as: TANKONGCHUMRUSKUL KIANGKAI
19 granted patents·6 pending applications·131 citations·filing 2006–2017
94Inventor score
Top patents by PatentIndex Score
25 records- 0195US7824013B2Integrated circuit support for low profile wire bondSILVERBROOK RES PTY LTD·Filed 2007·Granted Nov 2, 2010·23 cites·13 claims
- 0288US7946465B2Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted May 24, 2011·11 cites·15 claims
- 0386US7802715B2Method of wire bonding an integrated circuit die and a printed circuit boardSILVERBROOK RES PTY LTD·Filed 2010·Granted Sep 28, 2010·8 cites·15 claims
- 0485US7659141B2Wire bond encapsulant application controlSILVERBROOK RES PTY LTD·Filed 2007·Granted Feb 9, 2010·12 cites·17 claims
- 0582US8063318B2Electronic component with wire bonds in low modulus fill encapsulantWILLIAMS SUSAN·Filed 2009·Granted Nov 22, 2011·13 cites·18 claims
- 0682US7988033B2Method of reducing wire bond profile height in integrated circuits mounted to circuit boardsSILVERBROOK RES PTY LTD·Filed 2007·Granted Aug 2, 2011·11 cites·16 claims
- 0780US7571006B2Wearable alarm system for a prosthetic hearing implantGORDON BRIAN·Filed 2006·Granted Aug 4, 2009·27 cites·19 claims
- 0878US7875504B2Method of adhering wire bond loops to reduce loop heightSILVERBROOK RES PTY LTD·Filed 2008·Granted Jan 25, 2011·8 cites·17 claims
- 0969US10870003B2Wearable alarm system for a prosthetic hearing implantCOCHLEAR LTD·Filed 2017·Granted Dec 22, 2020·1 cites·14 claims
- 1069US7741720B2Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted Jun 22, 2010·3 cites·15 claims
- 1166US7915091B2Method of controlling satellite drops from an encapsulant jetterSILVERBROOK RES PTY LTD·Filed 2009·Granted Mar 29, 2011·4 cites·20 claims
- 1264US8039974B2Assembly of electronic componentsSILVERBROOK RES PTY LTD·Filed 2010·Granted Oct 18, 2011·1 cites·14 claims
- 1363US9630006B2Wearable alarm system for a prosthetic hearing implantGORDON BRIAN·Filed 2009·Granted Apr 25, 2017·4 cites·34 claims
- 1463US7669751B2Method of forming low profile wire bonds between integrated circuits dies and printed circuit boardsSILVERBROOK RES PTY LTD·Filed 2008·Granted Mar 2, 2010·2 cites·16 claims
- 1561US8025204B2Method of wire bond encapsulation profilingSILVERBROOK RES PTY LTD·Filed 2007·Granted Sep 27, 2011·2 cites·15 claims
- 1659US7618842B2Method of applying encapsulant to wire bondsSILVERBROOK RES PTY LTD·Filed 2007·Granted Nov 17, 2009·1 cites·18 claims
- 1754US7803659B2Method of encapsulating wire bondsSILVERBROOK RES PTY LTD·Filed 2009·Granted Sep 28, 2010·0 cites·17 claims
- 1849US2012018905A1Electronic component assembly having profiled encapsulated bondsSILVERBROOK KIA·Filed 2011·Application pending·0 cites
- 1945US2009079097A1Electronic component with wire bonds in low modulus fill encapsulantSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 2044US8017450B2Method of forming assymetrical encapsulant beadSILVERBROOK RES PTY LTD·Filed 2009·Granted Sep 13, 2011·0 cites·16 claims
- 2142US2010075464A1Method of reducing voids in encapsulantSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 2242US2010075465A1Method of reducing voids in encapsulantSILVERBROOK RES PTY LTD·Filed 2009·Application pending·0 cites
- 2342US2012048185A1Apparatus for forming asymmetrical encapsulant beads on wire bondsWILLIAMS SUSAN·Filed 2011·Application pending·0 cites
- 2442US2010075446A1Method of forming assymetrical encapsulant beadSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 2539US8293589B2Wire bond encapsulant control methodCHUNG-LONG-SHAN LAVAL·Filed 2010·Granted Oct 23, 2012·0 cites·11 claims
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