Inventor · disambiguated record
Thomas J. Brunschwiler
Also filed as: BRUNSCHWILER THOMAS · BRUNSCHWILER THOMAS J
91 granted patents·11 pending applications·801 citations·filing 2001–2023
99Inventor score
Top patents by PatentIndex Score
102 records- 0199US7990711B1Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plateIBM·Filed 2010·Granted Aug 2, 2011·142 cites·25 claims
- 0299US7928565B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2010·Granted Apr 19, 2011·67 cites·9 claims
- 0397US8363402B2Integrated circuit stackIBM·Filed 2008·Granted Jan 29, 2013·47 cites·20 claims
- 0496US9389362B1Adaptive optical interconnection of components of an electro-optical circuitIBM·Filed 2015·Granted Jul 12, 2016·21 cites·13 claims
- 0596US7808780B2Variable flow computer cooling system for a data center and method of operationIBM·Filed 2008·Granted Oct 5, 2010·53 cites·3 claims
- 0695US11235404B2Personalized copper block for selective solder removalIBM·Filed 2020·Granted Feb 1, 2022·4 cites·14 claims
- 0794US8937810B2Electronic assembly with detachable coolant manifold and coolant-cooled electronic moduleBRUNSCHWILER THOMAS J·Filed 2012·Granted Jan 20, 2015·24 cites·16 claims
- 0894US8106505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2007·Granted Jan 31, 2012·18 cites·1 claims
- 0994US7547582B2Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assembliesIBM·Filed 2006·Granted Jun 16, 2009·36 cites·5 claims
- 1093US10091909B2Method and device for cooling a heat generating componentGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 2, 2018·13 cites·12 claims
- 1193US9252072B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·8 cites·20 claims
- 1293US8659898B2Integrated circuit stackBRUNSCHWILER THOMAS J·Filed 2012·Granted Feb 25, 2014·15 cites·4 claims
- 1393US8427833B2Thermal power plane for integrated circuitsBAROWSKI HARRY·Filed 2010·Granted Apr 23, 2013·19 cites·24 claims
- 1493US7866173B2Variable performance server system and method of operationIBM·Filed 2008·Granted Jan 11, 2011·35 cites·20 claims
- 1592US9941189B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2015·Granted Apr 10, 2018·7 cites·24 claims
- 1692US9905505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·5 cites·19 claims
- 1792US9313921B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2013·Granted Apr 12, 2016·12 cites·19 claims
- 1892US9252071B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·7 cites·20 claims
- 1992US8413712B2Cooling deviceBRUNSCHWILER THOMAS J·Filed 2006·Granted Apr 9, 2013·27 cites·19 claims
- 2091US8004832B2Variable flow computer cooling system for a data center and method of operationIBM·Filed 2010·Granted Aug 23, 2011·23 cites·17 claims
- 2191US7271034B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2005·Granted Sep 18, 2007·17 cites·4 claims
- 2290US9905506B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·4 cites·19 claims
- 2390US8253234B2Optimized semiconductor packaging in a three-dimensional stackBAROWSKI HARRY·Filed 2010·Granted Aug 28, 2012·11 cites·6 claims
- 2490US7748440B2Patterned structure for a thermal interfaceIBM·Filed 2005·Granted Jul 6, 2010·19 cites·14 claims
- 2588US10527365B1Disconnect assembly for active cooling of packaged electronicsIBM·Filed 2018·Granted Jan 7, 2020·4 cites·18 claims
- 2688US10006571B2Releasable, threadless conduit connector for liquid manifoldIBM·Filed 2014·Granted Jun 26, 2018·4 cites·14 claims
- 2788US7713789B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2007·Granted May 11, 2010·12 cites·4 claims
- 2888US7532475B2Semiconductor chip assembly with flexible metal cantileversIBM·Filed 2006·Granted May 12, 2009·18 cites·17 claims
- 2987US10727159B2Counter-flow expanding channels for enhanced two-phase heat removalIBM·Filed 2019·Granted Jul 28, 2020·3 cites·20 claims
- 3087US10153250B2Flip-chip electronic device with carrier having heat dissipation elements free of solder maskIBM·Filed 2014·Granted Dec 11, 2018·6 cites·6 claims
- 3187US9648782B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2016·Granted May 9, 2017·5 cites·18 claims
- 3287US8107234B2Variable flow computer cooling system for a data center and method of operationBRUNSCHWILER THOMAS J·Filed 2010·Granted Jan 31, 2012·16 cites·15 claims
- 3385US9433077B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2015·Granted Aug 30, 2016·5 cites·12 claims
- 3485US8805132B2Integrated circuit package connected to a data transmission mediumBAROWSKI HARRY·Filed 2011·Granted Aug 12, 2014·8 cites·14 claims
- 3584US8629554B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jan 14, 2014·6 cites·7 claims
- 3684US7282799B2Thermal interface with a patterned structureIBM·Filed 2006·Granted Oct 16, 2007·12 cites·16 claims
- 3783US9066460B2Disassemblable electronic assembly with leak-inhibiting coolant capillariesIBM·Filed 2013·Granted Jun 23, 2015·6 cites·20 claims
- 3882US8487427B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jul 16, 2013·5 cites·11 claims
- 3981US11880755B2Semi-supervised learning with group constraintsIBM·Filed 2020·Granted Jan 23, 2024·2 cites·17 claims
- 4081US9576922B2Silver alloying post-chip joinGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 21, 2017·4 cites·20 claims
- 4180US10622294B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Apr 14, 2020·1 cites·20 claims
- 4280US10607963B2Chip package for two-phase cooling and assembly process thereofIBM·Filed 2016·Granted Mar 31, 2020·3 cites·12 claims
- 4380US10586760B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Mar 10, 2020·1 cites·20 claims
- 4480US10278306B2Method and device for cooling a heat generating componentGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 30, 2019·3 cites·8 claims
- 4580US9698089B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2016·Granted Jul 4, 2017·4 cites·20 claims
- 4679US8476112B2Optimized semiconductor packaging in a three-dimensional stackBAROWSKI HARRY·Filed 2012·Granted Jul 2, 2013·4 cites·8 claims
- 4779US8405998B2Heat sink integrated power delivery and distribution for integrated circuitsBAROWSKI HARRY·Filed 2010·Granted Mar 26, 2013·5 cites·24 claims
- 4875US10388540B2High-performance compliant heat-exchanger comprising vapor chamberIBM·Filed 2017·Granted Aug 20, 2019·2 cites·15 claims
- 4975US10107426B2Releasable, threadless conduit connector for liquid manifoldIBM·Filed 2015·Granted Oct 23, 2018·1 cites·15 claims
- 5074US8989532B2Integrated circuit package connected to an optical data transmission medium using a coolantBAROWSKI HARRY·Filed 2011·Granted Mar 24, 2015·3 cites·16 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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